JPS63172128U - - Google Patents
Info
- Publication number
- JPS63172128U JPS63172128U JP6623487U JP6623487U JPS63172128U JP S63172128 U JPS63172128 U JP S63172128U JP 6623487 U JP6623487 U JP 6623487U JP 6623487 U JP6623487 U JP 6623487U JP S63172128 U JPS63172128 U JP S63172128U
- Authority
- JP
- Japan
- Prior art keywords
- reaction tube
- heat treatment
- utility
- treatment apparatus
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000005192 partition Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
Description
第１図は、この考案に係る縦型半導体熱処理装
置の概略縦断面図、第２図は、格子状部材の斜視
図、第３図は、第１図のＡ部の拡大図である。
１０：縦型半導体熱処理装置、１２：反応管、
１４：ヒータ、１６：断熱部材、１８：炉体カバ
ー、２０：均熱部材、２４：ウエーハ、２６：ウ
エーハボート、３２：格子状部材、３４：空間、
３５：空間の隔壁。
FIG. 1 is a schematic vertical sectional view of a vertical semiconductor heat treatment apparatus according to the invention, FIG. 2 is a perspective view of a lattice-like member, and FIG. 3 is an enlarged view of section A in FIG. 1. 10: Vertical semiconductor heat treatment equipment, 12: Reaction tube,
14: Heater, 16: Heat insulating member, 18: Furnace cover, 20: Soaking member, 24: Wafer, 26: Wafer boat, 32: Grid member, 34: Space,
35: Partition wall of space.
Claims (1)
加熱している半導体熱処理装置において、 格子状部材をヒータと反応管との間に配設して
、それらの間の隙間を細分化したことを特徴とす
る半導体熱処理装置。 (2) 均熱部材が、格子状部材と反応管との間に
介在されている実用新案登録第１項記載の半導体
熱処理装置。 (3) 格子状部材が、均熱部材の外面に固着され
ている実用新案登録第２項記載の半導体熱処理装
置。[Scope of Claim for Utility Model Registration] (1) In a semiconductor heat treatment device in which a heater is disposed around the reaction tube to heat the reaction tube, a grid-like member is disposed between the heater and the reaction tube. , a semiconductor heat treatment apparatus characterized in that the gap between them is subdivided. (2) The semiconductor heat treatment apparatus according to item 1 of the utility model registration, wherein the heat equalizing member is interposed between the grid member and the reaction tube. (3) The semiconductor heat treatment apparatus according to item 2 of the utility model registration, wherein the grid member is fixed to the outer surface of the heat equalizing member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6623487U JPS63172128U (en) | 1987-04-30 | 1987-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6623487U JPS63172128U (en) | 1987-04-30 | 1987-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63172128U true JPS63172128U (en) | 1988-11-09 |
Family
ID=30904051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6623487U Pending JPS63172128U (en) | 1987-04-30 | 1987-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63172128U (en) |
-
1987
- 1987-04-30 JP JP6623487U patent/JPS63172128U/ja active Pending
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