JPS5874339U - semiconductor manufacturing equipment - Google Patents
semiconductor manufacturing equipmentInfo
- Publication number
- JPS5874339U JPS5874339U JP16954281U JP16954281U JPS5874339U JP S5874339 U JPS5874339 U JP S5874339U JP 16954281 U JP16954281 U JP 16954281U JP 16954281 U JP16954281 U JP 16954281U JP S5874339 U JPS5874339 U JP S5874339U
- Authority
- JP
- Japan
- Prior art keywords
- core tube
- semiconductor manufacturing
- furnace core
- manufacturing equipment
- duct
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図はこの考案の一実施例を模式的に示す部分断面正
面図、第2図は第1図の■−■線の概略断面図、第3図
はこの考案の他の実施例を示す概略断面図である。
1・・・・・・炉芯管、1a・・・・・・炉芯管内部、
1b・・・・・・炉芯管内壁面、2.・・・・・・ヒー
タ、3・・・・・・マザーボート(支持台)、6・・・
・・・半導体ウェーハ、8・・・・・・ダクト、9・・
・・・・小孔。Fig. 1 is a partially sectional front view schematically showing one embodiment of this invention, Fig. 2 is a schematic sectional view taken along the line ■-■ in Fig. 1, and Fig. 3 shows another embodiment of this invention. It is a schematic sectional view. 1...Furnace core tube, 1a...Furnace core tube interior,
1b... Furnace core tube inner wall surface, 2. ...Heater, 3...Mother boat (support stand), 6...
...Semiconductor wafer, 8...Duct, 9...
...Small hole.
Claims (1)
熱処理を行なう装置において、多数の小孔を介して炉芯
管内雰囲気に連通ずるダクトを設け、このダクト内部を
減圧可能に構成すると共に、ダクトの上記小孔を出入時
の上記支持台と炉芯管内壁面との接触部近傍に沿って配
設したことを特徴とする半導体製造装置。In an apparatus in which a semiconductor wafer is housed in a furnace core tube along with its support stand for heat treatment, a duct is provided that communicates with the atmosphere inside the furnace core tube through a large number of small holes, and the inside of this duct is configured to be able to reduce the pressure. A semiconductor manufacturing apparatus characterized in that said small hole is arranged along a vicinity of a contact portion between said support stand and an inner wall surface of a furnace core tube when entering and exiting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16954281U JPS5874339U (en) | 1981-11-13 | 1981-11-13 | semiconductor manufacturing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16954281U JPS5874339U (en) | 1981-11-13 | 1981-11-13 | semiconductor manufacturing equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5874339U true JPS5874339U (en) | 1983-05-19 |
Family
ID=29961530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16954281U Pending JPS5874339U (en) | 1981-11-13 | 1981-11-13 | semiconductor manufacturing equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5874339U (en) |
-
1981
- 1981-11-13 JP JP16954281U patent/JPS5874339U/en active Pending
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