JPS6244438U - - Google Patents
Info
- Publication number
- JPS6244438U JPS6244438U JP13542785U JP13542785U JPS6244438U JP S6244438 U JPS6244438 U JP S6244438U JP 13542785 U JP13542785 U JP 13542785U JP 13542785 U JP13542785 U JP 13542785U JP S6244438 U JPS6244438 U JP S6244438U
- Authority
- JP
- Japan
- Prior art keywords
- reaction tube
- heat treatment
- positioning structure
- vertical semiconductor
- semiconductor heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 description 2
Description
第１図および第２図は、炉体に反応管が取付け
られた縦型半導体熱処理装置の概略縦断面図およ
び概略平面図である。
１０：縦型半導体熱処理装置の反応管位置決め
構造、１２，１４：係合手段、１６：反応管、１
８：反応管のフランジ、２０：炉体、２２：炉体
の支持面、２４：炉体の嵌合孔、２６：保護パイ
プ、２８：保護パイプの突出端部、３０：切欠き
（係合手段）、３２：突起（係合手段）。
1 and 2 are a schematic longitudinal sectional view and a schematic plan view of a vertical semiconductor heat treatment apparatus in which a reaction tube is attached to a furnace body. 10: Reaction tube positioning structure of vertical semiconductor heat treatment apparatus, 12, 14: Engagement means, 16: Reaction tube, 1
8: Flange of reaction tube, 20: Furnace body, 22: Support surface of furnace body, 24: Fitting hole of furnace body, 26: Protective pipe, 28: Projecting end of protective pipe, 30: Notch (engaging means), 32: protrusion (engaging means).
Claims (1)
手段の一方を、反応管のフランジに、他方を、炉
体の支持面に、それぞれ設けた縦型半導体熱処理
装置の反応管位置決め構造。 (2) 係合手段の一方を、反応管のフランジの下
面に、他方を、炉体の支持面の上面に、それぞれ
設けた実用新案登録請求の範囲第１項記載の縦型
半導体熱処理装置の反応管位置決め構造。 (3) 係合手段は、係合凸部および係合凹部の組
合せから構成される実用新案登録請求の範囲第１
項または第２項記載の縦型半導体熱処理装回の反
応管位置決め構造。 (4) 係合手段の一方は、反応管のフランジの側
面に設けられた切欠きであり、他方は、炉体の支
持面の上面に設けられて切欠きに収納される突起
である実用新案登録請求の範囲第１項記載の縦型
半導体熱処理装置の反応管位置決め構造。[Claims for Utility Model Registration] (1) Vertical semiconductor heat treatment in which one of at least a pair of corresponding engaging means is provided on the flange of the reaction tube and the other on the supporting surface of the furnace body. Reaction tube positioning structure of the device. (2) The vertical semiconductor heat treatment apparatus according to claim 1, wherein one of the engaging means is provided on the lower surface of the flange of the reaction tube, and the other is provided on the upper surface of the supporting surface of the furnace body. Reaction tube positioning structure. (3) The engaging means is comprised of a combination of an engaging protrusion and an engaging recess, as claimed in Claim 1 of the Utility Model Registration.
A reaction tube positioning structure for a vertical semiconductor heat treatment equipment according to item 1 or 2. (4) A utility model in which one of the engaging means is a notch provided on the side surface of the flange of the reaction tube, and the other is a protrusion provided on the upper surface of the supporting surface of the furnace body and accommodated in the notch. A reaction tube positioning structure for a vertical semiconductor heat treatment apparatus according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13542785U JPS6244438U (en) | 1985-09-04 | 1985-09-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13542785U JPS6244438U (en) | 1985-09-04 | 1985-09-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6244438U true JPS6244438U (en) | 1987-03-17 |
Family
ID=31037599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13542785U Pending JPS6244438U (en) | 1985-09-04 | 1985-09-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6244438U (en) |
-
1985
- 1985-09-04 JP JP13542785U patent/JPS6244438U/ja active Pending