JPS63145557U - - Google Patents

Info

Publication number
JPS63145557U
JPS63145557U JP3940087U JP3940087U JPS63145557U JP S63145557 U JPS63145557 U JP S63145557U JP 3940087 U JP3940087 U JP 3940087U JP 3940087 U JP3940087 U JP 3940087U JP S63145557 U JPS63145557 U JP S63145557U
Authority
JP
Japan
Prior art keywords
printed wiring
electronic circuit
reflow soldering
wiring board
soldering apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3940087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3940087U priority Critical patent/JPS63145557U/ja
Publication of JPS63145557U publication Critical patent/JPS63145557U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す第3図のA―
A線断面図、第2図は本考案の一実施例を示す斜
視図、第3図は第2図中のA部の詳細を示す拡大
斜視図である。 1…赤外線リフローはんだ付装置、2…永久磁
石、3…フラツトIC、4…プリント基板。
Figure 1 shows an embodiment of the present invention.
2 is a perspective view showing an embodiment of the present invention, and FIG. 3 is an enlarged perspective view showing details of section A in FIG. 2. 1...Infrared reflow soldering device, 2...Permanent magnet, 3...Flat IC, 4...Printed circuit board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] クリームはんだを塗布した表面にフラツト形電
子回路部品を搭載した印刷配線基板を搭載して搬
送する搬送部と、前記印刷配線基板に赤外線を照
射してその輻射熱によつて前記クリームはんだを
溶解して前記フラツト形電子回路部品を前記印刷
配線基板の印刷配線に接続する赤外線照射部とを
備える赤外線リフローはんだ付装置において、前
記搬送部に永久磁石を設けたことを特徴とする赤
外線リフローはんだ付装置。
A conveyance section that carries a printed wiring board with flat electronic circuit components mounted on a surface coated with cream solder; An infrared reflow soldering apparatus comprising an infrared irradiation unit for connecting the flat electronic circuit component to the printed wiring of the printed wiring board, the infrared reflow soldering apparatus comprising a permanent magnet in the conveyance unit.
JP3940087U 1987-03-17 1987-03-17 Pending JPS63145557U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3940087U JPS63145557U (en) 1987-03-17 1987-03-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3940087U JPS63145557U (en) 1987-03-17 1987-03-17

Publications (1)

Publication Number Publication Date
JPS63145557U true JPS63145557U (en) 1988-09-26

Family

ID=30852527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3940087U Pending JPS63145557U (en) 1987-03-17 1987-03-17

Country Status (1)

Country Link
JP (1) JPS63145557U (en)

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