JPH0270476U - - Google Patents
Info
- Publication number
- JPH0270476U JPH0270476U JP14961088U JP14961088U JPH0270476U JP H0270476 U JPH0270476 U JP H0270476U JP 14961088 U JP14961088 U JP 14961088U JP 14961088 U JP14961088 U JP 14961088U JP H0270476 U JPH0270476 U JP H0270476U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- insulating agent
- liquid insulating
- transfer member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図はこの考案の一実施例によるプリント基
板塗布装置の構成を示す正面図、第２図はその詳
細図、第３図はこの考案の他の実施例による対応
を示す正面図、第４図はその時の転写用部材を示
す斜視図、第５図および第６図はプリント基板に
電子部品が挿入された実装プリント基板の斜視図
と正面図、第７図および第８図は従来のプリント
基板の塗布方式を示す斜視図である。
図において、１はプリント基板、２は電子部品
、４ａはリード端部、１４は液体状絶縁剤、１３
は転写用部材である。なお、各図中、同一符号は
同一又は相当部分を示す。
FIG. 1 is a front view showing the configuration of a printed circuit board coating apparatus according to one embodiment of this invention, FIG. 2 is a detailed view thereof, FIG. 3 is a front view showing a correspondence according to another embodiment of this invention, and FIG. The figure is a perspective view showing the transfer member at that time, Figures 5 and 6 are perspective views and front views of a mounted printed circuit board with electronic components inserted into the printed circuit board, and Figures 7 and 8 are conventional printed circuit boards. FIG. 3 is a perspective view showing a method of coating a substrate. In the figure, 1 is a printed circuit board, 2 is an electronic component, 4a is a lead end, 14 is a liquid insulating agent, 13
is a transfer member. In each figure, the same reference numerals indicate the same or equivalent parts.
Claims (1)
部に絶縁剤を塗布するプリント基板塗布装置にお
いて、液体状絶縁剤と、柔軟質の転写用部材を用
いて液体状絶縁剤を膜状に保有した該転写用部材
をプリント基板に押圧し、該液体状絶縁剤をプリ
ント基板表面へ転写することを特徴とするプリン
ト基板塗布装置。 A printed circuit board coating device that applies an insulating agent to the lead ends of electronic components inserted into a printed circuit board uses a liquid insulating agent and a flexible transfer member to hold the liquid insulating agent in the form of a film. A printed circuit board coating apparatus characterized by pressing a transfer member against a printed circuit board and transferring the liquid insulating agent to the surface of the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14961088U JPH0270476U (en) | 1988-11-16 | 1988-11-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14961088U JPH0270476U (en) | 1988-11-16 | 1988-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270476U true JPH0270476U (en) | 1990-05-29 |
Family
ID=31421996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14961088U Pending JPH0270476U (en) | 1988-11-16 | 1988-11-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270476U (en) |
-
1988
- 1988-11-16 JP JP14961088U patent/JPH0270476U/ja active Pending
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