JPS61156267U - - Google Patents
Info
- Publication number
- JPS61156267U JPS61156267U JP3857985U JP3857985U JPS61156267U JP S61156267 U JPS61156267 U JP S61156267U JP 3857985 U JP3857985 U JP 3857985U JP 3857985 U JP3857985 U JP 3857985U JP S61156267 U JPS61156267 U JP S61156267U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- cream solder
- screen
- circuit board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000006071 cream Substances 0.000 claims description 6
Landscapes
- Screen Printers (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Printing Plates And Materials Therefor (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案装置の一例の使用状態における
一部分の断面図、第２図は同、一部分の平面図、
第３図は従来のクリーム半田印刷装置の使用状態
における断面図である。
図中、１は硬質プリント基板、３はフレキシブ
ルプリント基板、８はプリント回路基板、９ａは
基板凸部、９ｂは基板凹部、１０はクリーム半田
、１１は半田スクリーン、１２ａはスクリーン凹
部、１２ｂはスクリーン凸部である。
FIG. 1 is a cross-sectional view of a portion of an example of the device of the present invention in use, FIG. 2 is a plan view of a portion of the same,
FIG. 3 is a cross-sectional view of a conventional cream solder printing device in use. In the figure, 1 is a rigid printed circuit board, 3 is a flexible printed circuit board, 8 is a printed circuit board, 9a is a protrusion of the board, 9b is a recess of the board, 10 is cream solder, 11 is a solder screen, 12a is a screen recess, and 12b is a screen It is a convex part.
Claims (1)
の回路部品が実装される部位にクリーム半田を半
田スクリーンを用いて塗布するクリーム半田印刷
装置において、 上記半田スクリーンの上記プリント回路基板に
対応する部面に、 上記プリント回路基板の凹凸部と対応して凸凹
部を形成し、 上記スクリーンを上記プリント回路基板上に密
接させてクリーム半田印刷が行なえるようにした
ことを特徴とするプリント回路基板のクリーム半
田印刷装置。[Scope of Claim for Utility Model Registration] In a cream solder printing device that uses a solder screen to apply cream solder to a portion where a circuit component of a circuit pattern formed on a printed circuit board is to be mounted, the printed circuit on the solder screen. A surface corresponding to the board is formed with uneven parts corresponding to the uneven parts of the printed circuit board, and the screen is brought into close contact with the printed circuit board so that cream solder printing can be performed. Cream solder printing equipment for printed circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3857985U JPS61156267U (en) | 1985-03-18 | 1985-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3857985U JPS61156267U (en) | 1985-03-18 | 1985-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61156267U true JPS61156267U (en) | 1986-09-27 |
Family
ID=30545719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3857985U Pending JPS61156267U (en) | 1985-03-18 | 1985-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61156267U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006130689A (en) * | 2004-11-02 | 2006-05-25 | Alpine Electronics Inc | Metal mask and screen printing equipment |
-
1985
- 1985-03-18 JP JP3857985U patent/JPS61156267U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006130689A (en) * | 2004-11-02 | 2006-05-25 | Alpine Electronics Inc | Metal mask and screen printing equipment |