JPS63142826A - プロ−ブカ−ド - Google Patents

プロ−ブカ−ド

Info

Publication number
JPS63142826A
JPS63142826A JP29115786A JP29115786A JPS63142826A JP S63142826 A JPS63142826 A JP S63142826A JP 29115786 A JP29115786 A JP 29115786A JP 29115786 A JP29115786 A JP 29115786A JP S63142826 A JPS63142826 A JP S63142826A
Authority
JP
Japan
Prior art keywords
probe
stylus
wafer
chips
probe needle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP29115786A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0582972B2 (enrdf_load_stackoverflow
Inventor
Noboru Masuoka
増岡　昇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP29115786A priority Critical patent/JPS63142826A/ja
Publication of JPS63142826A publication Critical patent/JPS63142826A/ja
Publication of JPH0582972B2 publication Critical patent/JPH0582972B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP29115786A 1986-12-05 1986-12-05 プロ−ブカ−ド Granted JPS63142826A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29115786A JPS63142826A (ja) 1986-12-05 1986-12-05 プロ−ブカ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29115786A JPS63142826A (ja) 1986-12-05 1986-12-05 プロ−ブカ−ド

Publications (2)

Publication Number Publication Date
JPS63142826A true JPS63142826A (ja) 1988-06-15
JPH0582972B2 JPH0582972B2 (enrdf_load_stackoverflow) 1993-11-24

Family

ID=17765182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29115786A Granted JPS63142826A (ja) 1986-12-05 1986-12-05 プロ−ブカ−ド

Country Status (1)

Country Link
JP (1) JPS63142826A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5631573A (en) * 1994-09-20 1997-05-20 Mitsubishi Denki Kabushiki Kaisha Probe-type test handler
EP0908944A1 (fr) * 1997-10-09 1999-04-14 Commissariat A L'energie Atomique Caractérisation électrique d'une couche isolante recouvrant un substrat conducteur ou semiconducteur
JP2005297185A (ja) * 2004-04-15 2005-10-27 Fei Co 微小構造を修正するためのスタイラス・システム

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5040550U (enrdf_load_stackoverflow) * 1973-08-04 1975-04-24
JPS5569058A (en) * 1978-11-20 1980-05-24 Fujitsu Ltd Contact method for probe
JPS57115841A (en) * 1981-01-10 1982-07-19 Nec Corp Probing method
JPS58169068A (ja) * 1982-03-31 1983-10-05 Toshiba Corp 半導体装置の特性測定方法
JPS58148935U (ja) * 1982-03-31 1983-10-06 日本電子材料株式会社 プロ−ブカ−ド

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5040550U (enrdf_load_stackoverflow) * 1973-08-04 1975-04-24
JPS5569058A (en) * 1978-11-20 1980-05-24 Fujitsu Ltd Contact method for probe
JPS57115841A (en) * 1981-01-10 1982-07-19 Nec Corp Probing method
JPS58169068A (ja) * 1982-03-31 1983-10-05 Toshiba Corp 半導体装置の特性測定方法
JPS58148935U (ja) * 1982-03-31 1983-10-06 日本電子材料株式会社 プロ−ブカ−ド

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5631573A (en) * 1994-09-20 1997-05-20 Mitsubishi Denki Kabushiki Kaisha Probe-type test handler
EP0908944A1 (fr) * 1997-10-09 1999-04-14 Commissariat A L'energie Atomique Caractérisation électrique d'une couche isolante recouvrant un substrat conducteur ou semiconducteur
FR2769753A1 (fr) * 1997-10-09 1999-04-16 Commissariat Energie Atomique Caracterisation electrique d'une couche isolante recouvrant un substrat conducteur ou semiconducteur
US6074886A (en) * 1997-10-09 2000-06-13 Commissariat A L'energie Atomique Electrical characterization of an insulating layer covering a conducting or semiconducting substrate
JP2005297185A (ja) * 2004-04-15 2005-10-27 Fei Co 微小構造を修正するためのスタイラス・システム

Also Published As

Publication number Publication date
JPH0582972B2 (enrdf_load_stackoverflow) 1993-11-24

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