JPH0582972B2 - - Google Patents

Info

Publication number
JPH0582972B2
JPH0582972B2 JP61291157A JP29115786A JPH0582972B2 JP H0582972 B2 JPH0582972 B2 JP H0582972B2 JP 61291157 A JP61291157 A JP 61291157A JP 29115786 A JP29115786 A JP 29115786A JP H0582972 B2 JPH0582972 B2 JP H0582972B2
Authority
JP
Japan
Prior art keywords
probe
probe needle
electrode pad
wafer
needle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61291157A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63142826A (ja
Inventor
Noboru Masuoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP29115786A priority Critical patent/JPS63142826A/ja
Publication of JPS63142826A publication Critical patent/JPS63142826A/ja
Publication of JPH0582972B2 publication Critical patent/JPH0582972B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP29115786A 1986-12-05 1986-12-05 プロ−ブカ−ド Granted JPS63142826A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29115786A JPS63142826A (ja) 1986-12-05 1986-12-05 プロ−ブカ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29115786A JPS63142826A (ja) 1986-12-05 1986-12-05 プロ−ブカ−ド

Publications (2)

Publication Number Publication Date
JPS63142826A JPS63142826A (ja) 1988-06-15
JPH0582972B2 true JPH0582972B2 (enrdf_load_stackoverflow) 1993-11-24

Family

ID=17765182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29115786A Granted JPS63142826A (ja) 1986-12-05 1986-12-05 プロ−ブカ−ド

Country Status (1)

Country Link
JP (1) JPS63142826A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2929948B2 (ja) * 1994-09-20 1999-08-03 三菱電機株式会社 プローブ式テストハンドラー及びそれを用いたｉｃのテスト方法
FR2769753B1 (fr) * 1997-10-09 1999-12-03 Commissariat Energie Atomique Caracterisation electrique d'une couche isolante recouvrant un substrat conducteur ou semiconducteur
EP1587113B1 (en) * 2004-04-15 2012-10-03 Fei Company Stylus system for modifying small structures

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5040550U (enrdf_load_stackoverflow) * 1973-08-04 1975-04-24
JPS5569058A (en) * 1978-11-20 1980-05-24 Fujitsu Ltd Contact method for probe
JPS57115841A (en) * 1981-01-10 1982-07-19 Nec Corp Probing method
JPS58169068A (ja) * 1982-03-31 1983-10-05 Toshiba Corp 半導体装置の特性測定方法
JPS58148935U (ja) * 1982-03-31 1983-10-06 日本電子材料株式会社 プロ−ブカ−ド

Also Published As

Publication number Publication date
JPS63142826A (ja) 1988-06-15

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