JPS6313332A - 半導体製造装置 - Google Patents

半導体製造装置

Info

Publication number
JPS6313332A
JPS6313332A JP61156243A JP15624386A JPS6313332A JP S6313332 A JPS6313332 A JP S6313332A JP 61156243 A JP61156243 A JP 61156243A JP 15624386 A JP15624386 A JP 15624386A JP S6313332 A JPS6313332 A JP S6313332A
Authority
JP
Japan
Prior art keywords
wafer
row
unit
chuck
oven
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61156243A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0230194B2 (Direct
Inventor
Yoshiki Iwata
岩田　義樹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Canon Marketing Japan Inc
Original Assignee
Canon Inc
Canon Hanbai KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc, Canon Hanbai KK filed Critical Canon Inc
Priority to JP61156243A priority Critical patent/JPS6313332A/ja
Priority to GB8715456A priority patent/GB2194500B/en
Priority to DE19873722080 priority patent/DE3722080A1/de
Publication of JPS6313332A publication Critical patent/JPS6313332A/ja
Priority to US07/453,188 priority patent/US5015177A/en
Publication of JPH0230194B2 publication Critical patent/JPH0230194B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP61156243A 1986-07-04 1986-07-04 半導体製造装置 Granted JPS6313332A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP61156243A JPS6313332A (ja) 1986-07-04 1986-07-04 半導体製造装置
GB8715456A GB2194500B (en) 1986-07-04 1987-07-01 A wafer handling apparatus
DE19873722080 DE3722080A1 (de) 1986-07-04 1987-07-03 Einrichtung zum bearbeiten von halbleiterplaettchen
US07/453,188 US5015177A (en) 1986-07-04 1989-12-15 Wafer handling apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61156243A JPS6313332A (ja) 1986-07-04 1986-07-04 半導体製造装置

Publications (2)

Publication Number Publication Date
JPS6313332A true JPS6313332A (ja) 1988-01-20
JPH0230194B2 JPH0230194B2 (Direct) 1990-07-04

Family

ID=15623504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61156243A Granted JPS6313332A (ja) 1986-07-04 1986-07-04 半導体製造装置

Country Status (1)

Country Link
JP (1) JPS6313332A (Direct)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63287016A (ja) * 1987-05-19 1988-11-24 Mitsubishi Electric Corp レジスト塗布・現像装置
JPH01238664A (ja) * 1988-03-18 1989-09-22 Toppan Printing Co Ltd 現像処理機構を有する処理装置
JPH01241840A (ja) * 1988-03-24 1989-09-26 Canon Inc 基板処理装置
JPH021907A (ja) * 1988-06-09 1990-01-08 Nec Kyushu Ltd インライン型半導体熱処理装置
JPH02132840A (ja) * 1988-02-12 1990-05-22 Tokyo Electron Ltd 処理装置及びレジスト処理装置及び処理方法及びレジスト処理方法
JPH02164050A (ja) * 1988-12-19 1990-06-25 Tokyo Electron Ltd 半導体製造装置
JPH0352226A (ja) * 1989-07-20 1991-03-06 Tokyo Electron Ltd 洗浄装置及び洗浄方法
JPH03290946A (ja) * 1990-03-30 1991-12-20 Tokyo Electron Ltd 処理装置および処理方法およびレジスト処理装置
US5339128A (en) * 1988-02-12 1994-08-16 Tokyo Electron Limited Resist processing method
JPH07161632A (ja) * 1993-07-16 1995-06-23 Semiconductor Syst Inc 基板コーティング／現像システム用熱処理モジュール
JPH0851139A (ja) * 1990-03-30 1996-02-20 Tokyo Electron Ltd 処理装置
JPH08227928A (ja) * 1988-02-12 1996-09-03 Tokyo Electron Ltd レジスト処理装置及びレジスト処理方法
JPH08227929A (ja) * 1988-02-12 1996-09-03 Tokyo Electron Ltd 処理装置
JPH08227927A (ja) * 1988-02-12 1996-09-03 Tokyo Electron Ltd 処理装置
JPH08264621A (ja) * 1988-02-12 1996-10-11 Tokyo Electron Ltd 処理方法及び処理装置
JPH08321537A (ja) * 1996-05-20 1996-12-03 Tokyo Electron Ltd 処理装置及び処理方法
US6287067B1 (en) 1996-06-21 2001-09-11 Tokyo Ohka Kogyo Co., Ltd. Processing unit and processing unit structure by assembling thereof
JP2012054469A (ja) * 2010-09-02 2012-03-15 Tokyo Electron Ltd 塗布、現像装置、塗布、現像方法及び記憶媒体
US9108512B2 (en) 2011-12-22 2015-08-18 Toyota Jidosha Kabushiki Kaisha Transfer device

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63287016A (ja) * 1987-05-19 1988-11-24 Mitsubishi Electric Corp レジスト塗布・現像装置
US5339128A (en) * 1988-02-12 1994-08-16 Tokyo Electron Limited Resist processing method
JPH08264621A (ja) * 1988-02-12 1996-10-11 Tokyo Electron Ltd 処理方法及び処理装置
JPH08227927A (ja) * 1988-02-12 1996-09-03 Tokyo Electron Ltd 処理装置
JPH02132840A (ja) * 1988-02-12 1990-05-22 Tokyo Electron Ltd 処理装置及びレジスト処理装置及び処理方法及びレジスト処理方法
JPH08227929A (ja) * 1988-02-12 1996-09-03 Tokyo Electron Ltd 処理装置
JPH08227928A (ja) * 1988-02-12 1996-09-03 Tokyo Electron Ltd レジスト処理装置及びレジスト処理方法
JPH01238664A (ja) * 1988-03-18 1989-09-22 Toppan Printing Co Ltd 現像処理機構を有する処理装置
JPH01241840A (ja) * 1988-03-24 1989-09-26 Canon Inc 基板処理装置
JPH021907A (ja) * 1988-06-09 1990-01-08 Nec Kyushu Ltd インライン型半導体熱処理装置
JPH02164050A (ja) * 1988-12-19 1990-06-25 Tokyo Electron Ltd 半導体製造装置
JPH0352226A (ja) * 1989-07-20 1991-03-06 Tokyo Electron Ltd 洗浄装置及び洗浄方法
JPH03290946A (ja) * 1990-03-30 1991-12-20 Tokyo Electron Ltd 処理装置および処理方法およびレジスト処理装置
JPH0851139A (ja) * 1990-03-30 1996-02-20 Tokyo Electron Ltd 処理装置
JPH07161632A (ja) * 1993-07-16 1995-06-23 Semiconductor Syst Inc 基板コーティング／現像システム用熱処理モジュール
JPH08321537A (ja) * 1996-05-20 1996-12-03 Tokyo Electron Ltd 処理装置及び処理方法
US6287067B1 (en) 1996-06-21 2001-09-11 Tokyo Ohka Kogyo Co., Ltd. Processing unit and processing unit structure by assembling thereof
JP2012054469A (ja) * 2010-09-02 2012-03-15 Tokyo Electron Ltd 塗布、現像装置、塗布、現像方法及び記憶媒体
US9108512B2 (en) 2011-12-22 2015-08-18 Toyota Jidosha Kabushiki Kaisha Transfer device

Also Published As

Publication number Publication date
JPH0230194B2 (Direct) 1990-07-04

Similar Documents

Publication Publication Date Title
JPS6313332A (ja) 半導体製造装置
US5651823A (en) Clustered photolithography system
EP0634783B1 (en) Thermal process module for substrate coat/develop system
KR100251340B1 (ko) 기판처리장치 및 기판처리방법
JPH07297258A (ja) 板状体の搬送装置
US6377329B1 (en) Substrate processing apparatus
JPS6052035A (ja) 半導体ウエ−ハの処理装置
GB2217107A (en) Workpiece processing apparatus
KR101452543B1 (ko) 기판 처리 시스템
JP3442686B2 (ja) 基板処理装置
JPS62104049A (ja) ベ−キング炉装置
US6309116B1 (en) Substrate processing system
JP2004087570A (ja) 基板処理装置
JPH029788B2 (Direct)
JP3056468B2 (ja) 半導体ウエハーの加工処理システム
JP3928902B2 (ja) 基板製造ラインおよび基板製造方法
CN1089487C (zh) 半导体晶片的热处理装置
JP2010182919A (ja) 基板処理システム
JP3483693B2 (ja) 搬送装置，搬送方法及び処理システム
JPH1121620A (ja) 誘導加熱による自動焼入装置
JP2001274221A (ja) 板状体の搬送装置および搬送方法、ならびに処理装置
JPH09275127A (ja) 基板処理装置
JPH0380701B2 (Direct)
CN111613557A (zh) 一种晶圆处理设备
JP3521388B2 (ja) 基板搬送装置及び処理システム

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term