JPS63131560A - チップ接続構造体 - Google Patents

チップ接続構造体

Info

Publication number
JPS63131560A
JPS63131560A JP62201998A JP20199887A JPS63131560A JP S63131560 A JPS63131560 A JP S63131560A JP 62201998 A JP62201998 A JP 62201998A JP 20199887 A JP20199887 A JP 20199887A JP S63131560 A JPS63131560 A JP S63131560A
Authority
JP
Japan
Prior art keywords
inclusion
substrate
inclusions
wiring
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62201998A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0239101B2 (cg-RX-API-DMAC10.html
Inventor
チャールズ・ジョン・クラウス
レオン・リィーヘング・ウー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS63131560A publication Critical patent/JPS63131560A/ja
Publication of JPH0239101B2 publication Critical patent/JPH0239101B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/611—
    • H10W44/601—
    • H10W70/641—
    • H10W90/401—
    • H10W72/07251—
    • H10W72/20—

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Memory System Of A Hierarchy Structure (AREA)
  • Surgical Instruments (AREA)
JP62201998A 1986-11-17 1987-08-14 チップ接続構造体 Granted JPS63131560A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US93148886A 1986-11-17 1986-11-17
US931488 1986-11-17

Publications (2)

Publication Number Publication Date
JPS63131560A true JPS63131560A (ja) 1988-06-03
JPH0239101B2 JPH0239101B2 (cg-RX-API-DMAC10.html) 1990-09-04

Family

ID=25460858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62201998A Granted JPS63131560A (ja) 1986-11-17 1987-08-14 チップ接続構造体

Country Status (2)

Country Link
EP (1) EP0268111A3 (cg-RX-API-DMAC10.html)
JP (1) JPS63131560A (cg-RX-API-DMAC10.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2569053B2 (ja) * 1987-06-26 1997-01-08 キヤノン株式会社 イメ−ジセンサ
FR2634340B1 (fr) * 1988-07-13 1994-06-17 Thomson Csf Dispositif d'interconnexion entre un circuit integre et un circuit electrique, application du dispositif a la connexion d'un circuit integre notamment a un circuit imprime, et procede de fabrication du dispositif
FR2647961B1 (fr) * 1989-05-30 1994-04-08 Thomson Composants Milit Spatiau Circuit electronique a plusieurs puces, en boitier ceramique avec puce d'interconnexion
DE3925554A1 (de) * 1989-08-02 1991-02-07 Schroff Gmbh Baugruppentraeger bzw. gehaeuse fuer die aufnahme von elektronische bauelemente aufweisenden steckbaugruppen
JPH0378290A (ja) * 1989-08-21 1991-04-03 Hitachi Ltd 多層配線基板
US5414637A (en) * 1992-06-24 1995-05-09 International Business Machines Corporation Intra-module spare routing for high density electronic packages
US5382827A (en) * 1992-08-07 1995-01-17 Fujitsu Limited Functional substrates for packaging semiconductor chips
US5475262A (en) * 1992-08-07 1995-12-12 Fujitsu Limited Functional substrates for packaging semiconductor chips
US5371654A (en) * 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
GB2307334A (en) * 1995-11-16 1997-05-21 Marconi Gec Ltd Electronic component packaging

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52140866A (en) * 1976-05-20 1977-11-24 Matsushita Electric Industrial Co Ltd Printed circuit board
JPS549767A (en) * 1977-06-24 1979-01-24 Nippon Electric Co Substrate for multiilayer wiring
JPS589597A (ja) * 1981-07-10 1983-01-19 Fuji Xerox Co Ltd ステツプモ−タ駆動回路

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5687395A (en) * 1979-12-18 1981-07-15 Fujitsu Ltd Semiconductor device
US4617730A (en) * 1984-08-13 1986-10-21 International Business Machines Corporation Method of fabricating a chip interposer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52140866A (en) * 1976-05-20 1977-11-24 Matsushita Electric Industrial Co Ltd Printed circuit board
JPS549767A (en) * 1977-06-24 1979-01-24 Nippon Electric Co Substrate for multiilayer wiring
JPS589597A (ja) * 1981-07-10 1983-01-19 Fuji Xerox Co Ltd ステツプモ−タ駆動回路

Also Published As

Publication number Publication date
JPH0239101B2 (cg-RX-API-DMAC10.html) 1990-09-04
EP0268111A3 (en) 1988-09-14
EP0268111A2 (en) 1988-05-25

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