JPS549767A - Substrate for multiilayer wiring - Google Patents

Substrate for multiilayer wiring

Info

Publication number
JPS549767A
JPS549767A JP7573477A JP7573477A JPS549767A JP S549767 A JPS549767 A JP S549767A JP 7573477 A JP7573477 A JP 7573477A JP 7573477 A JP7573477 A JP 7573477A JP S549767 A JPS549767 A JP S549767A
Authority
JP
Japan
Prior art keywords
multiilayer
wiring
substrate
multiilayer wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7573477A
Other languages
Japanese (ja)
Inventor
Hiroetsu Yamazaki
Hisao Kanai
Masamichi Murase
Takashi Nakahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP7573477A priority Critical patent/JPS549767A/en
Publication of JPS549767A publication Critical patent/JPS549767A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP7573477A 1977-06-24 1977-06-24 Substrate for multiilayer wiring Pending JPS549767A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7573477A JPS549767A (en) 1977-06-24 1977-06-24 Substrate for multiilayer wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7573477A JPS549767A (en) 1977-06-24 1977-06-24 Substrate for multiilayer wiring

Publications (1)

Publication Number Publication Date
JPS549767A true JPS549767A (en) 1979-01-24

Family

ID=13584789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7573477A Pending JPS549767A (en) 1977-06-24 1977-06-24 Substrate for multiilayer wiring

Country Status (1)

Country Link
JP (1) JPS549767A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55105398A (en) * 1979-02-08 1980-08-12 Cho Lsi Gijutsu Kenkyu Kumiai High packing density multilayer circuit board
JPS6035598A (en) * 1983-04-22 1985-02-23 クレイ　リサーチ，インコーポレイテイド Circuit module with high cooling efficiency
JPS6138997U (en) * 1984-08-10 1986-03-11 イビデン株式会社 Board for mounting electronic components
JPS6158297A (en) * 1984-08-29 1986-03-25 沖電気工業株式会社 Multilayer printed circuit board
JPS63131560A (en) * 1986-11-17 1988-06-03 インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション Chip joint structure
JPS6395278U (en) * 1986-12-11 1988-06-20
JPH02232992A (en) * 1989-03-06 1990-09-14 Nippon Telegr & Teleph Corp <Ntt> Electronic circuit module
JPH0497552A (en) * 1990-08-14 1992-03-30 Matsushita Electric Works Ltd Heat dissipation type semiconductor package
JPH04291999A (en) * 1991-03-20 1992-10-16 Fujitsu Ltd Part cooling structure

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0121638B2 (en) * 1979-02-08 1989-04-21 Cho Eru Esu Ai Gijutsu Kenkyu Kumiai
JPS55105398A (en) * 1979-02-08 1980-08-12 Cho Lsi Gijutsu Kenkyu Kumiai High packing density multilayer circuit board
JPS6035598A (en) * 1983-04-22 1985-02-23 クレイ　リサーチ，インコーポレイテイド Circuit module with high cooling efficiency
JPH0552079B2 (en) * 1983-04-22 1993-08-04 Kurei Risaachi Inc
JPS6138997U (en) * 1984-08-10 1986-03-11 イビデン株式会社 Board for mounting electronic components
JPH056714Y2 (en) * 1984-08-10 1993-02-19
JPS6158297A (en) * 1984-08-29 1986-03-25 沖電気工業株式会社 Multilayer printed circuit board
JPH0239101B2 (en) * 1986-11-17 1990-09-04 Intaanashonaru Bijinesu Mashiinzu Corp
JPS63131560A (en) * 1986-11-17 1988-06-03 インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション Chip joint structure
JPS6395278U (en) * 1986-12-11 1988-06-20
JPH02232992A (en) * 1989-03-06 1990-09-14 Nippon Telegr & Teleph Corp <Ntt> Electronic circuit module
JPH0497552A (en) * 1990-08-14 1992-03-30 Matsushita Electric Works Ltd Heat dissipation type semiconductor package
JPH04291999A (en) * 1991-03-20 1992-10-16 Fujitsu Ltd Part cooling structure

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