JPS6312938B2 - - Google Patents

Info

Publication number
JPS6312938B2
JPS6312938B2 JP54068950A JP6895079A JPS6312938B2 JP S6312938 B2 JPS6312938 B2 JP S6312938B2 JP 54068950 A JP54068950 A JP 54068950A JP 6895079 A JP6895079 A JP 6895079A JP S6312938 B2 JPS6312938 B2 JP S6312938B2
Authority
JP
Japan
Prior art keywords
thin film
gas
flow rate
film forming
rate control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54068950A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55161067A (en
Inventor
Taiji Shimomoto
Susumu Myagawa
Shigetoshi Hiratsuka
Yasuo Tanaka
Akio Kumada
Eiichi Maruyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6895079A priority Critical patent/JPS55161067A/ja
Publication of JPS55161067A publication Critical patent/JPS55161067A/ja
Publication of JPS6312938B2 publication Critical patent/JPS6312938B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/006—Processes utilising sub-atmospheric pressure; Apparatus therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
JP6895079A 1979-06-04 1979-06-04 Manufacturing apparatus of thin film Granted JPS55161067A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6895079A JPS55161067A (en) 1979-06-04 1979-06-04 Manufacturing apparatus of thin film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6895079A JPS55161067A (en) 1979-06-04 1979-06-04 Manufacturing apparatus of thin film

Publications (2)

Publication Number Publication Date
JPS55161067A JPS55161067A (en) 1980-12-15
JPS6312938B2 true JPS6312938B2 (enrdf_load_stackoverflow) 1988-03-23

Family

ID=13388446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6895079A Granted JPS55161067A (en) 1979-06-04 1979-06-04 Manufacturing apparatus of thin film

Country Status (1)

Country Link
JP (1) JPS55161067A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006045611A (ja) * 2004-08-04 2006-02-16 Nippon Telegr & Teleph Corp <Ntt> スパッタ成膜装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967619A (ja) * 1982-10-12 1984-04-17 Kokusai Electric Co Ltd 減圧容器を有する半導体製造装置の圧力制御装置
US4428811A (en) * 1983-04-04 1984-01-31 Borg-Warner Corporation Rapid rate reactive sputtering of a group IVb metal
US6106676A (en) * 1998-04-16 2000-08-22 The Boc Group, Inc. Method and apparatus for reactive sputtering employing two control loops
JP2002275628A (ja) * 2001-03-21 2002-09-25 Sumitomo Bakelite Co Ltd スパッタリング成膜方法
JP2002322561A (ja) * 2001-04-25 2002-11-08 Sumitomo Bakelite Co Ltd スパッタリング成膜方法
JP2010199305A (ja) * 2009-02-25 2010-09-09 Mitsubishi Heavy Ind Ltd 光電変換装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2371009A1 (fr) * 1976-11-15 1978-06-09 Commissariat Energie Atomique Procede de controle du depot de couches par pulverisation reactive et dispositif de mise en oeuvre
JPS54103790A (en) * 1978-02-01 1979-08-15 Nec Corp Sputtering apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006045611A (ja) * 2004-08-04 2006-02-16 Nippon Telegr & Teleph Corp <Ntt> スパッタ成膜装置

Also Published As

Publication number Publication date
JPS55161067A (en) 1980-12-15

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