JPS54103790A - Sputtering apparatus - Google Patents

Sputtering apparatus

Info

Publication number
JPS54103790A
JPS54103790A JP1095078A JP1095078A JPS54103790A JP S54103790 A JPS54103790 A JP S54103790A JP 1095078 A JP1095078 A JP 1095078A JP 1095078 A JP1095078 A JP 1095078A JP S54103790 A JPS54103790 A JP S54103790A
Authority
JP
Japan
Prior art keywords
gas
controller
pressure
enters
active
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1095078A
Other languages
Japanese (ja)
Inventor
Taiji Hiraga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP1095078A priority Critical patent/JPS54103790A/en
Publication of JPS54103790A publication Critical patent/JPS54103790A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:A highly operatable, precisely controllable, labor saving sputtering apparatus is provided. Such apparatus is constructed by including an automatic innert gas flow rate controller and an automatic pressure controller to maintain a constant pressure by controlling gas flow rate. CONSTITUTION:An active gas 18 enters the flow detector 17 which converts a flow rate into an electric signal and puts out to the flow controller 19. An active-gas flow- rate 18 is automatically adjusted by the gas valve 16 controlled by the signal from the controller 19. The active gas then enters the gas mixer 11. Meanwhile, an innert gas 14 such as Ar passed the innert gas conduct valve 12 which is actuated by the signal from the pressure controller 15. The innert gas then enters the gas mixer 11. In the gas mixer 11, the active and inner gas are mixed and enters the vacuum container 5. The controller 15 takes the input signal from the pressure detector 20 that detects container pressure 5. The container pressure 5 is controlled by the automatic valve 12 so that an input signal deviation from the controller- stored value 15 is made to zero.
JP1095078A 1978-02-01 1978-02-01 Sputtering apparatus Pending JPS54103790A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1095078A JPS54103790A (en) 1978-02-01 1978-02-01 Sputtering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1095078A JPS54103790A (en) 1978-02-01 1978-02-01 Sputtering apparatus

Publications (1)

Publication Number Publication Date
JPS54103790A true JPS54103790A (en) 1979-08-15

Family

ID=11764470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1095078A Pending JPS54103790A (en) 1978-02-01 1978-02-01 Sputtering apparatus

Country Status (1)

Country Link
JP (1) JPS54103790A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55161067A (en) * 1979-06-04 1980-12-15 Hitachi Ltd Manufacturing apparatus of thin film
JPS59185776A (en) * 1983-04-04 1984-10-22 ボ−グ・ワ−ナ−・コ−ポレ−シヨン Iv b group metal quick reactive sputtering

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55161067A (en) * 1979-06-04 1980-12-15 Hitachi Ltd Manufacturing apparatus of thin film
JPS6312938B2 (en) * 1979-06-04 1988-03-23 Hitachi Ltd
JPS59185776A (en) * 1983-04-04 1984-10-22 ボ−グ・ワ−ナ−・コ−ポレ−シヨン Iv b group metal quick reactive sputtering

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