JPS63128020A - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS63128020A
JPS63128020A JP61272838A JP27283886A JPS63128020A JP S63128020 A JPS63128020 A JP S63128020A JP 61272838 A JP61272838 A JP 61272838A JP 27283886 A JP27283886 A JP 27283886A JP S63128020 A JPS63128020 A JP S63128020A
Authority
JP
Japan
Prior art keywords
particle size
resin composition
filler
epoxy resin
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61272838A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0554865B2 (enrdf_load_stackoverflow
Inventor
Masaji Ogata
正次 尾形
Masanori Segawa
正則 瀬川
Hidetoshi Abe
英俊 阿部
Shigeo Suzuki
重雄 鈴木
Hiroyuki Hozoji
裕之 宝蔵寺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP61272838A priority Critical patent/JPS63128020A/ja
Publication of JPS63128020A publication Critical patent/JPS63128020A/ja
Priority to JP4178867A priority patent/JP2649632B2/ja
Publication of JPH0554865B2 publication Critical patent/JPH0554865B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Epoxy Resins (AREA)
JP61272838A 1986-11-18 1986-11-18 樹脂封止型半導体装置 Granted JPS63128020A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP61272838A JPS63128020A (ja) 1986-11-18 1986-11-18 樹脂封止型半導体装置
JP4178867A JP2649632B2 (ja) 1986-11-18 1992-06-15 樹脂封止型半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP61272838A JPS63128020A (ja) 1986-11-18 1986-11-18 樹脂封止型半導体装置
JP4178867A JP2649632B2 (ja) 1986-11-18 1992-06-15 樹脂封止型半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP4178867A Division JP2649632B2 (ja) 1986-11-18 1992-06-15 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS63128020A true JPS63128020A (ja) 1988-05-31
JPH0554865B2 JPH0554865B2 (enrdf_load_stackoverflow) 1993-08-13

Family

ID=26498917

Family Applications (2)

Application Number Title Priority Date Filing Date
JP61272838A Granted JPS63128020A (ja) 1986-11-18 1986-11-18 樹脂封止型半導体装置
JP4178867A Expired - Lifetime JP2649632B2 (ja) 1986-11-18 1992-06-15 樹脂封止型半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP4178867A Expired - Lifetime JP2649632B2 (ja) 1986-11-18 1992-06-15 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (2) JPS63128020A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01294765A (ja) * 1988-05-20 1989-11-28 Nippon Retsuku Kk エポキシ樹脂組成物
JPH0299552A (ja) * 1988-10-06 1990-04-11 Toray Ind Inc 半導体封止用エポキシ樹脂組成物
JPH02110958A (ja) * 1988-10-19 1990-04-24 Mitsubishi Electric Corp 半導体封止用エポキシ樹脂組成物
WO2002034832A1 (fr) * 2000-10-24 2002-05-02 Mitsui Chemicals, Inc. Composition de resine epoxy et son utilisation

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6165578A (en) 1997-07-23 2000-12-26 Matsushita Electric Industrial Co., Ltd. Optical information recording medium and method for producing the same
JP3249957B2 (ja) 2000-07-27 2002-01-28 株式会社日立製作所 面付実装型樹脂封止半導体装置
TWI412506B (zh) 2006-05-12 2013-10-21 Denki Kagaku Kogyo Kk 陶瓷粉末及其用途
JP2008115381A (ja) * 2006-10-13 2008-05-22 Hitachi Chem Co Ltd エポキシ樹脂組成物およびそれを用いた電子部品装置
JP5345787B2 (ja) * 2008-02-04 2013-11-20 電気化学工業株式会社 半導体封止材用シリカ・アルミナ複合酸化物超微粉末の製造方法
JP2011035465A (ja) * 2009-07-29 2011-02-17 Nippon Ceramic Co Ltd 超音波送受波器
WO2022071140A1 (ja) 2020-09-29 2022-04-07 デンカ株式会社 球状アルミナ粉末、樹脂組成物、放熱材料

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53123457A (en) * 1977-04-05 1978-10-27 Hitachi Ltd Molding resin composition
JPS57212225A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS61113642A (ja) * 1984-11-09 1986-05-31 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPS61190961A (ja) * 1985-02-19 1986-08-25 Nitto Electric Ind Co Ltd 半導体装置
JPS6296568A (ja) * 1985-10-24 1987-05-06 Denki Kagaku Kogyo Kk 半導体封止用樹脂組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138740A (ja) * 1982-02-15 1983-08-17 Denki Kagaku Kogyo Kk 樹脂組成物
JPS63108021A (ja) * 1986-10-24 1988-05-12 Hitachi Ltd 樹脂封止型半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53123457A (en) * 1977-04-05 1978-10-27 Hitachi Ltd Molding resin composition
JPS57212225A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS61113642A (ja) * 1984-11-09 1986-05-31 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPS61190961A (ja) * 1985-02-19 1986-08-25 Nitto Electric Ind Co Ltd 半導体装置
JPS6296568A (ja) * 1985-10-24 1987-05-06 Denki Kagaku Kogyo Kk 半導体封止用樹脂組成物

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01294765A (ja) * 1988-05-20 1989-11-28 Nippon Retsuku Kk エポキシ樹脂組成物
JPH0299552A (ja) * 1988-10-06 1990-04-11 Toray Ind Inc 半導体封止用エポキシ樹脂組成物
JPH02110958A (ja) * 1988-10-19 1990-04-24 Mitsubishi Electric Corp 半導体封止用エポキシ樹脂組成物
WO2002034832A1 (fr) * 2000-10-24 2002-05-02 Mitsui Chemicals, Inc. Composition de resine epoxy et son utilisation

Also Published As

Publication number Publication date
JPH0680863A (ja) 1994-03-22
JP2649632B2 (ja) 1997-09-03
JPH0554865B2 (enrdf_load_stackoverflow) 1993-08-13

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