JPH0142631B2 - - Google Patents
Info
- Publication number
- JPH0142631B2 JPH0142631B2 JP58125389A JP12538983A JPH0142631B2 JP H0142631 B2 JPH0142631 B2 JP H0142631B2 JP 58125389 A JP58125389 A JP 58125389A JP 12538983 A JP12538983 A JP 12538983A JP H0142631 B2 JPH0142631 B2 JP H0142631B2
- Authority
- JP
- Japan
- Prior art keywords
- filler
- particle size
- semiconductor
- circuit width
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58125389A JPS6017937A (ja) | 1983-07-12 | 1983-07-12 | 半導体封止用樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58125389A JPS6017937A (ja) | 1983-07-12 | 1983-07-12 | 半導体封止用樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6017937A JPS6017937A (ja) | 1985-01-29 |
JPH0142631B2 true JPH0142631B2 (enrdf_load_stackoverflow) | 1989-09-13 |
Family
ID=14908921
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58125389A Granted JPS6017937A (ja) | 1983-07-12 | 1983-07-12 | 半導体封止用樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6017937A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62128159A (ja) * | 1985-11-29 | 1987-06-10 | Hitachi Ltd | 高集積lsiプラスチツクパツケ−ジ |
JPH0668010B2 (ja) * | 1987-09-28 | 1994-08-31 | 東レ株式会社 | 半導体封止用樹脂組成物 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5743435A (en) * | 1980-08-28 | 1982-03-11 | Nec Home Electronics Ltd | Electronic part |
-
1983
- 1983-07-12 JP JP58125389A patent/JPS6017937A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6017937A (ja) | 1985-01-29 |
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