JPH0142631B2 - - Google Patents
Info
- Publication number
- JPH0142631B2 JPH0142631B2 JP58125389A JP12538983A JPH0142631B2 JP H0142631 B2 JPH0142631 B2 JP H0142631B2 JP 58125389 A JP58125389 A JP 58125389A JP 12538983 A JP12538983 A JP 12538983A JP H0142631 B2 JPH0142631 B2 JP H0142631B2
- Authority
- JP
- Japan
- Prior art keywords
- filler
- particle size
- semiconductor
- circuit width
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58125389A JPS6017937A (ja) | 1983-07-12 | 1983-07-12 | 半導体封止用樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58125389A JPS6017937A (ja) | 1983-07-12 | 1983-07-12 | 半導体封止用樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6017937A JPS6017937A (ja) | 1985-01-29 |
| JPH0142631B2 true JPH0142631B2 (enrdf_load_stackoverflow) | 1989-09-13 |
Family
ID=14908921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58125389A Granted JPS6017937A (ja) | 1983-07-12 | 1983-07-12 | 半導体封止用樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6017937A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62128159A (ja) * | 1985-11-29 | 1987-06-10 | Hitachi Ltd | 高集積lsiプラスチツクパツケ−ジ |
| JPH0668010B2 (ja) * | 1987-09-28 | 1994-08-31 | 東レ株式会社 | 半導体封止用樹脂組成物 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5743435A (en) * | 1980-08-28 | 1982-03-11 | Nec Home Electronics Ltd | Electronic part |
-
1983
- 1983-07-12 JP JP58125389A patent/JPS6017937A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6017937A (ja) | 1985-01-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3468996B2 (ja) | エポキシ樹脂組成物及び樹脂封止型半導体装置 | |
| JPS627211B2 (enrdf_load_stackoverflow) | ||
| JP2853550B2 (ja) | エポキシ樹脂組成物及びその製造方法及びそれを用いた半導体装置 | |
| JP2000007890A (ja) | 半導体封止用エポキシ樹脂組成物およびその製法ならびに半導体装置 | |
| JPH08157561A (ja) | 半導体封止用エポキシ樹脂組成物及び半導体装置 | |
| JPH0657740B2 (ja) | 半導体封止用エポキシ樹脂組成物 | |
| JPH0142631B2 (enrdf_load_stackoverflow) | ||
| JPH032390B2 (enrdf_load_stackoverflow) | ||
| JPS63230725A (ja) | 半導体封止用エポキシ樹脂組成物 | |
| JP2002309067A (ja) | 封止用エポキシ樹脂組成物及び半導体装置 | |
| JP2593503B2 (ja) | エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置 | |
| JPS6017936A (ja) | 半導体封止用樹脂組成物 | |
| JP4525141B2 (ja) | 半導体封止用エポキシ樹脂組成物の製造方法及びエリア実装型半導体封止用エポキシ樹脂組成物の製造方法 | |
| KR930001989B1 (ko) | 반도체 밀봉용 에폭시 수지 조성물 | |
| WO2020026818A1 (ja) | フレーク状封止用樹脂組成物、および半導体装置 | |
| JP4380237B2 (ja) | 熱硬化性樹脂組成物エポキシ樹脂組成物及び半導体装置 | |
| JPS63108021A (ja) | 樹脂封止型半導体装置 | |
| JP2006257309A (ja) | 半導体封止用エポキシ樹脂組成物及び半導体装置 | |
| JP3880211B2 (ja) | 封止用樹脂組成物および半導体装置 | |
| JP2000169675A (ja) | エポキシ樹脂組成物及び半導体装置 | |
| JPS61243853A (ja) | エポキシ樹脂組成物 | |
| JP2635621B2 (ja) | 半導体装置封止用樹脂組成物 | |
| JPH07300517A (ja) | エポキシ樹脂組成物 | |
| JPS6377922A (ja) | 半導体封止用エポキシ樹脂組成物 | |
| JPS61204257A (ja) | 半導体封止用エポキシ樹脂組成物 |