JPH0142631B2 - - Google Patents

Info

Publication number
JPH0142631B2
JPH0142631B2 JP58125389A JP12538983A JPH0142631B2 JP H0142631 B2 JPH0142631 B2 JP H0142631B2 JP 58125389 A JP58125389 A JP 58125389A JP 12538983 A JP12538983 A JP 12538983A JP H0142631 B2 JPH0142631 B2 JP H0142631B2
Authority
JP
Japan
Prior art keywords
filler
particle size
semiconductor
circuit width
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58125389A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6017937A (ja
Inventor
Shigeru Koshibe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP58125389A priority Critical patent/JPS6017937A/ja
Publication of JPS6017937A publication Critical patent/JPS6017937A/ja
Publication of JPH0142631B2 publication Critical patent/JPH0142631B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • H01L23/295Organic, e.g. plastic containing a filler
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58125389A 1983-07-12 1983-07-12 半導体封止用樹脂組成物 Granted JPS6017937A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58125389A JPS6017937A (ja) 1983-07-12 1983-07-12 半導体封止用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58125389A JPS6017937A (ja) 1983-07-12 1983-07-12 半導体封止用樹脂組成物

Publications (2)

Publication Number Publication Date
JPS6017937A JPS6017937A (ja) 1985-01-29
JPH0142631B2 true JPH0142631B2 (enrdf_load_stackoverflow) 1989-09-13

Family

ID=14908921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58125389A Granted JPS6017937A (ja) 1983-07-12 1983-07-12 半導体封止用樹脂組成物

Country Status (1)

Country Link
JP (1) JPS6017937A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62128159A (ja) * 1985-11-29 1987-06-10 Hitachi Ltd 高集積lsiプラスチツクパツケ−ジ
JPH0668010B2 (ja) * 1987-09-28 1994-08-31 東レ株式会社 半導体封止用樹脂組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5743435A (en) * 1980-08-28 1982-03-11 Nec Home Electronics Ltd Electronic part

Also Published As

Publication number Publication date
JPS6017937A (ja) 1985-01-29

Similar Documents

Publication Publication Date Title
JP3468996B2 (ja) エポキシ樹脂組成物及び樹脂封止型半導体装置
JPS6274924A (ja) 半導体装置封止用エポキシ樹脂組成物
JPS627211B2 (enrdf_load_stackoverflow)
JP2853550B2 (ja) エポキシ樹脂組成物及びその製造方法及びそれを用いた半導体装置
JP2000007890A (ja) 半導体封止用エポキシ樹脂組成物およびその製法ならびに半導体装置
JPH08157561A (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2004018803A (ja) エポキシ樹脂組成物及び半導体装置
JPH0657740B2 (ja) 半導体封止用エポキシ樹脂組成物
JPH0142631B2 (enrdf_load_stackoverflow)
JPH032390B2 (enrdf_load_stackoverflow)
JPS63230725A (ja) 半導体封止用エポキシ樹脂組成物
JP2002309067A (ja) 封止用エポキシ樹脂組成物及び半導体装置
JP6941737B2 (ja) フレーク状封止用樹脂組成物、および半導体装置
JP2593503B2 (ja) エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置
JPS6017936A (ja) 半導体封止用樹脂組成物
JP4525141B2 (ja) 半導体封止用エポキシ樹脂組成物の製造方法及びエリア実装型半導体封止用エポキシ樹脂組成物の製造方法
KR930001989B1 (ko) 반도체 밀봉용 에폭시 수지 조성물
JP4380237B2 (ja) 熱硬化性樹脂組成物エポキシ樹脂組成物及び半導体装置
JPS63108021A (ja) 樹脂封止型半導体装置
JP2006257309A (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JP3880211B2 (ja) 封止用樹脂組成物および半導体装置
JP2000169675A (ja) エポキシ樹脂組成物及び半導体装置
JPS61243853A (ja) エポキシ樹脂組成物
JPH0726061A (ja) 充填剤およびそれを用いた樹脂組成物
JP2635621B2 (ja) 半導体装置封止用樹脂組成物