JPS6017937A - 半導体封止用樹脂組成物 - Google Patents

半導体封止用樹脂組成物

Info

Publication number
JPS6017937A
JPS6017937A JP58125389A JP12538983A JPS6017937A JP S6017937 A JPS6017937 A JP S6017937A JP 58125389 A JP58125389 A JP 58125389A JP 12538983 A JP12538983 A JP 12538983A JP S6017937 A JPS6017937 A JP S6017937A
Authority
JP
Japan
Prior art keywords
filler
particle size
semiconductor
resin composition
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58125389A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0142631B2 (enrdf_load_stackoverflow
Inventor
Shigeru Koshibe
茂 越部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP58125389A priority Critical patent/JPS6017937A/ja
Publication of JPS6017937A publication Critical patent/JPS6017937A/ja
Publication of JPH0142631B2 publication Critical patent/JPH0142631B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58125389A 1983-07-12 1983-07-12 半導体封止用樹脂組成物 Granted JPS6017937A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58125389A JPS6017937A (ja) 1983-07-12 1983-07-12 半導体封止用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58125389A JPS6017937A (ja) 1983-07-12 1983-07-12 半導体封止用樹脂組成物

Publications (2)

Publication Number Publication Date
JPS6017937A true JPS6017937A (ja) 1985-01-29
JPH0142631B2 JPH0142631B2 (enrdf_load_stackoverflow) 1989-09-13

Family

ID=14908921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58125389A Granted JPS6017937A (ja) 1983-07-12 1983-07-12 半導体封止用樹脂組成物

Country Status (1)

Country Link
JP (1) JPS6017937A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62128159A (ja) * 1985-11-29 1987-06-10 Hitachi Ltd 高集積ｌｓｉプラスチツクパツケ−ジ
JPS6487616A (en) * 1987-09-28 1989-03-31 Toray Industries Resin composition for sealing semiconductor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5743435A (en) * 1980-08-28 1982-03-11 Nec Home Electronics Ltd Electronic part

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5743435A (en) * 1980-08-28 1982-03-11 Nec Home Electronics Ltd Electronic part

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62128159A (ja) * 1985-11-29 1987-06-10 Hitachi Ltd 高集積ｌｓｉプラスチツクパツケ−ジ
JPS6487616A (en) * 1987-09-28 1989-03-31 Toray Industries Resin composition for sealing semiconductor

Also Published As

Publication number Publication date
JPH0142631B2 (enrdf_load_stackoverflow) 1989-09-13

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