JPS6326128B2 - - Google Patents
Info
- Publication number
- JPS6326128B2 JPS6326128B2 JP60096450A JP9645085A JPS6326128B2 JP S6326128 B2 JPS6326128 B2 JP S6326128B2 JP 60096450 A JP60096450 A JP 60096450A JP 9645085 A JP9645085 A JP 9645085A JP S6326128 B2 JPS6326128 B2 JP S6326128B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- weight
- parts
- quartz
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9645085A JPS61254619A (ja) | 1985-05-07 | 1985-05-07 | 半導体封止用エポキシ樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9645085A JPS61254619A (ja) | 1985-05-07 | 1985-05-07 | 半導体封止用エポキシ樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61254619A JPS61254619A (ja) | 1986-11-12 |
JPS6326128B2 true JPS6326128B2 (enrdf_load_stackoverflow) | 1988-05-28 |
Family
ID=14165354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9645085A Granted JPS61254619A (ja) | 1985-05-07 | 1985-05-07 | 半導体封止用エポキシ樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61254619A (enrdf_load_stackoverflow) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61268750A (ja) * | 1985-05-22 | 1986-11-28 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物 |
JP2523669B2 (ja) * | 1987-08-07 | 1996-08-14 | 日東電工株式会社 | 半導体装置 |
JPH0753791B2 (ja) * | 1987-09-04 | 1995-06-07 | 東レ株式会社 | 半導体封止用樹脂組成物 |
JPH07103263B2 (ja) * | 1988-04-15 | 1995-11-08 | 新日鐵化学株式会社 | 封止樹脂充填用シリカ |
JPH01294765A (ja) * | 1988-05-20 | 1989-11-28 | Nippon Retsuku Kk | エポキシ樹脂組成物 |
JPH0645740B2 (ja) * | 1989-03-01 | 1994-06-15 | 信越化学工業株式会社 | 半導体封止用エポキシ樹脂組成物 |
IT1268326B1 (it) * | 1994-08-05 | 1997-02-27 | Sasib Spa | Materiale composito, in particolare per la fabbricazione di componenti statici per macchine, nonche' componente statico |
JP2716962B2 (ja) * | 1996-01-29 | 1998-02-18 | 日東電工株式会社 | 半導体封止用エポキシ樹脂組成物 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53102361A (en) * | 1977-02-18 | 1978-09-06 | Toray Silicone Co Ltd | Thermosetting resin composition |
JPS5443021A (en) * | 1977-09-12 | 1979-04-05 | Minolta Camera Co Ltd | F/stop digital value display device of cameras |
JPS56122145A (en) * | 1980-02-29 | 1981-09-25 | Shin Etsu Chem Co Ltd | Resin composition for sealing semiconductor device |
JPS57195117A (en) * | 1981-05-27 | 1982-11-30 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and its preparation |
JPS58138740A (ja) * | 1982-02-15 | 1983-08-17 | Denki Kagaku Kogyo Kk | 樹脂組成物 |
JPS59108026A (ja) * | 1982-12-10 | 1984-06-22 | Toshiba Chem Corp | 封止用エポキシ樹脂組成物 |
JPS59204633A (ja) * | 1983-05-06 | 1984-11-20 | Denki Kagaku Kogyo Kk | 低放射能樹脂組成物 |
GB8320086D0 (en) * | 1983-07-26 | 1983-08-24 | Ciba Geigy Ag | Spherical fused silica |
-
1985
- 1985-05-07 JP JP9645085A patent/JPS61254619A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61254619A (ja) | 1986-11-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |