JPS63105835U

JPS63105835U -

Info

Publication number: JPS63105835U
Application number: JP19879586U
Authority: JP
Priority date: 1986-12-26
Filing date: 1986-12-26
Publication date: 1988-07-08

Description

[Brief explanation of the drawing]

第１図ａは本考案の一実施例を示す感圧半導体
素子の平面図、同図ｂはそのｂ―ｂ断面図、第２
図ａはキヤツプの上面図、同図ｂは下面図、同図
ｃは同図ａのｃ―ｃ断面図、第３図ａはキヤツプ
本体の上面図、同図ｂは下面図、同図ｃは同図ａ
のｃ―ｃ断面図、同図ｄは部分側面図、第４図ａ
は電界しやへい板の平面図、同図ｂは側面図、第
５図は本考案の他の実施例を示す感圧半導体素子
の断面図、第６図ａはボンデイング板の平面図、
同図ｂは同図ａのｂ―ｂ断面図である。１１，１１′……ヘツダ、１２……リードピン
、１３，１３′……ガラスシール部、１５……感
圧半導体素子、１７……キヤツプ、１８……電界
しやへい板、１９……ワイヤスプリング、１１１
，１１２，１１２′……凹部、１１２Ａ……溝、
１８１……メタリゼーシヨン膜。 FIG. 1a is a plan view of a pressure-sensitive semiconductor device showing an embodiment of the present invention, FIG.
Figure a is a top view of the cap, figure b is a bottom view, figure c is a sectional view taken along line c in figure a, figure 3 a is a top view of the cap body, figure b is a bottom view, figure 3 c is the same figure a
Figure 4a is a sectional view taken along line cc, Figure 4d is a partial side view, Figure 4a is a partial side view.
is a plan view of the electric field shielding plate, FIG. 5 is a side view, FIG.
Figure b is a sectional view taken along line bb in figure a. 11, 11'... Header, 12... Lead pin, 13, 13'... Glass seal portion, 15... Pressure sensitive semiconductor element, 17... Cap, 18... Electric field shielding plate, 19... Wire spring , 111
, 112, 112'... recess, 112A... groove,
181...Metallization film.

Claims

[Scope of utility model registration request]

A pressure-sensitive semiconductor element is fixed in a recessed part of an airtight terminal through which an electrode for extracting electric signals to the outside is airtightly penetrated, and an electric field shielding member having a conductive material layer covering the pressure-sensitive semiconductor element is arranged. The semiconductor pressure transducer is equipped with a partially open polygonal wire spring, and the electric field shielding member engages each corner of the wire spring with a groove provided in the inner peripheral surface of the recess of the airtight terminal. What is claimed is: 1. A semiconductor pressure transducer, characterized in that the semiconductor pressure transducer is fixed to an airtight terminal by locking each side to a shoulder of an electric field shielding member.