JPS63105837U - - Google Patents
Info
- Publication number
- JPS63105837U JPS63105837U JP20246286U JP20246286U JPS63105837U JP S63105837 U JPS63105837 U JP S63105837U JP 20246286 U JP20246286 U JP 20246286U JP 20246286 U JP20246286 U JP 20246286U JP S63105837 U JPS63105837 U JP S63105837U
- Authority
- JP
- Japan
- Prior art keywords
- airtight
- contact
- pressure
- constituent members
- pressure transducer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000470 constituent Substances 0.000 claims 2
- 239000007788 liquid Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図ａは本考案の一実施例を示す感圧半導体
素子の平面図、同図ｂはそのｂ―ｂ断面図、第２
図ａはキヤツプの上面図、同図ｂは下面図、同図
ｃは同図ａのｃ―ｃ断面図、第３図は本考案の効
果を示す実験を説明するための断面図、第４図は
同じく斜視図、第５図および第６図はそれぞれの
結果を示す図、第７図は本考案の他の実施例を示
す感圧半導体素子の断面図、第８図ａはボンデイ
ング板の平面図、同図ｂは同図ａのｂ―ｂ断面図
である。
１１，１１′……ヘツダ、１２……リードピン
、１３，１３′……ガラスシール部、１５……感
圧半導体素子、１７……キヤツプ、１８……電界
しやへい板、２１……スペーサ、２２……ボンデ
イング板、１７３，２１２，２２２……突起。
FIG. 1a is a plan view of a pressure-sensitive semiconductor device showing an embodiment of the present invention, FIG.
Figure a is a top view of the cap, figure b is a bottom view, figure c is a cross-sectional view taken along line CC in figure a, figure 3 is a cross-sectional view for explaining an experiment showing the effects of the present invention, figure 4 5 and 6 are diagrams showing the respective results. FIG. 7 is a sectional view of a pressure-sensitive semiconductor device showing another embodiment of the present invention. FIG. 8a is a diagram of a bonding plate. The plan view is a cross-sectional view taken along line bb in figure a. 11, 11'... Header, 12... Lead pin, 13, 13'... Glass seal portion, 15... Pressure sensitive semiconductor element, 17... Cap, 18... Electric field shielding plate, 21... Spacer, 22...Bonding plate, 173, 212, 222...Protrusion.
Claims (1)
貫通させた気密端子に、圧力―電気変換部を固定
し、かつ気密部を封入液で満たしてなる圧力変換
器において、気密部に配置された各構成部材相互
間および当該構成部材と気密端子間を、点状の接
触部により接触させたことを特徴とする圧力変換
器。 In a pressure transducer, a pressure-to-electrical converter is fixed to an airtight terminal through which an electrode for extracting an electric signal to the outside is airtight, and the airtight area is filled with a sealed liquid. A pressure transducer characterized in that the constituent members are in contact with each other and the constituent members and the airtight terminal are brought into contact through point-like contact portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20246286U JPS63105837U (en) | 1986-12-27 | 1986-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20246286U JPS63105837U (en) | 1986-12-27 | 1986-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63105837U true JPS63105837U (en) | 1988-07-08 |
Family
ID=31166865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20246286U Pending JPS63105837U (en) | 1986-12-27 | 1986-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63105837U (en) |
-
1986
- 1986-12-27 JP JP20246286U patent/JPS63105837U/ja active Pending
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