JPS62106143U - - Google Patents
Info
- Publication number
- JPS62106143U JPS62106143U JP19777385U JP19777385U JPS62106143U JP S62106143 U JPS62106143 U JP S62106143U JP 19777385 U JP19777385 U JP 19777385U JP 19777385 U JP19777385 U JP 19777385U JP S62106143 U JPS62106143 U JP S62106143U
- Authority
- JP
- Japan
- Prior art keywords
- header
- cylindrical
- pressure
- bottomed cylindrical
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- AZBAQHIVVLQMFX-UHFFFAOYSA-N 4-(2,4-dimethylphenyl)-5-methyl-1,3-thiazol-2-amine Chemical group S1C(N)=NC(C=2C(=CC(C)=CC=2)C)=C1C AZBAQHIVVLQMFX-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Description
第１図ないし第４図は本考案の一実施例を示す
図で、第１図ａはキヤツプの左側面図、同図ｂは
同図ａのｂ―ｂ断面図、第２図ａはセンサの側面
図、同図ｂは同図ａのｂ―ｂ断面図、第３図ａは
端子板の右側面図、同図ｂは同図ａのｂ―ｂ断面
図、第４図は感圧半導体素子と端子板との接続を
示す側面図である。
１１……ヘツダ、１２……リードピン、１４…
…円筒ホルダ、１５……感圧半導体素子、１６…
…スペーサ、１７……端子板、２０……キヤツプ
、２０１……開口。
1 to 4 are views showing one embodiment of the present invention, in which FIG. 1a is a left side view of the cap, FIG. 1b is a sectional view taken along line bb of FIG. Figure 3a is a right side view of the terminal board, Figure b is a bb-b sectional view of Figure a, Figure 4 is a pressure sensitive FIG. 3 is a side view showing the connection between a semiconductor element and a terminal board. 11...header, 12...lead pin, 14...
...Cylindrical holder, 15...Pressure-sensitive semiconductor element, 16...
...Spacer, 17...Terminal board, 20...Cap, 201...Opening.
Claims (1)
る有底筒状ヘツダと、このヘツダの底部内面に筒
状ホルダを介して固定された感圧半導体素子と、
有底筒状ヘツダと筒状ホルダとの間の空隙に配置
された上記リードピンの貫通孔を有するスペーサ
および端子板と、有底筒状ヘツダの開放端部内周
面に上記感圧半導体素子を覆うように嵌装された
有底筒状のキヤツプとを有し、キヤツプは、その
開放端部を端子板に固着されかつ当該固着部に対
応して底部に開口を有することを特徴とする半導
体圧力センサ。 a bottomed cylindrical header having lead pins hermetically fixed through the bottom; a pressure-sensitive semiconductor element fixed to the inner surface of the bottom of the header via a cylindrical holder;
A spacer and a terminal plate having through holes for the lead pins are disposed in the gap between the bottomed cylindrical header and the cylindrical holder, and the pressure-sensitive semiconductor element is covered on the inner peripheral surface of the open end of the bottomed cylindrical header. 2. A semiconductor pressure sensor comprising: a cylindrical cap with a bottom fitted in the cap as shown in FIG. sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19777385U JPS62106143U (en) | 1985-12-23 | 1985-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19777385U JPS62106143U (en) | 1985-12-23 | 1985-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62106143U true JPS62106143U (en) | 1987-07-07 |
Family
ID=31157841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19777385U Pending JPS62106143U (en) | 1985-12-23 | 1985-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62106143U (en) |
-
1985
- 1985-12-23 JP JP19777385U patent/JPS62106143U/ja active Pending
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