JPS6371549U - - Google Patents

Info

Publication number
JPS6371549U
JPS6371549U JP16694286U JP16694286U JPS6371549U JP S6371549 U JPS6371549 U JP S6371549U JP 16694286 U JP16694286 U JP 16694286U JP 16694286 U JP16694286 U JP 16694286U JP S6371549 U JPS6371549 U JP S6371549U
Authority
JP
Japan
Prior art keywords
integrated circuit
resin
sealed
lead terminal
protruded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16694286U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16694286U priority Critical patent/JPS6371549U/ja
Publication of JPS6371549U publication Critical patent/JPS6371549U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図aは本考案の一実施例の封止樹脂体(一
点鎖線の囲み)を透視して示した平面図、同図b
は断面図、第2図a,bは従来の樹脂封止集積回
路の平面図と断面図である。 1……集積回路素子、2,12……リード端子
、3……接続金属細線、4……封止樹脂体。
Fig. 1a is a plan view of the sealing resin body (encircled by a dashed-dotted line) of an embodiment of the present invention, and Fig. 1b is
2 is a sectional view, and FIGS. 2a and 2b are a plan view and a sectional view of a conventional resin-sealed integrated circuit. DESCRIPTION OF SYMBOLS 1... Integrated circuit element, 2, 12... Lead terminal, 3... Connection thin metal wire, 4... Sealing resin body.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 集積回路素子にリード端子を導電接続し、樹脂
封止した樹脂封止型集積回路において、前記リー
ド端子が前記封止樹脂体の下面から外部に突き出
されていることを特徴とする樹脂封止型集積回路
A resin-sealed integrated circuit in which a lead terminal is conductively connected to an integrated circuit element and sealed with resin, wherein the lead terminal is protruded from the bottom surface of the sealing resin body. integrated circuit.
JP16694286U 1986-10-29 1986-10-29 Pending JPS6371549U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16694286U JPS6371549U (en) 1986-10-29 1986-10-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16694286U JPS6371549U (en) 1986-10-29 1986-10-29

Publications (1)

Publication Number Publication Date
JPS6371549U true JPS6371549U (en) 1988-05-13

Family

ID=31098403

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16694286U Pending JPS6371549U (en) 1986-10-29 1986-10-29

Country Status (1)

Country Link
JP (1) JPS6371549U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49114359A (en) * 1973-02-28 1974-10-31
JPS503093U (en) * 1973-05-08 1975-01-13

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49114359A (en) * 1973-02-28 1974-10-31
JPS503093U (en) * 1973-05-08 1975-01-13

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