JPS6298638A - ダイボンデイング装置 - Google Patents

ダイボンデイング装置

Info

Publication number
JPS6298638A
JPS6298638A JP60238196A JP23819685A JPS6298638A JP S6298638 A JPS6298638 A JP S6298638A JP 60238196 A JP60238196 A JP 60238196A JP 23819685 A JP23819685 A JP 23819685A JP S6298638 A JPS6298638 A JP S6298638A
Authority
JP
Japan
Prior art keywords
die
needle
push
thrust
peripheral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60238196A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0354858B2 (enExample
Inventor
Kazuo Sugiura
一夫 杉浦
Nobuhito Yamazaki
山崎　信人
Takatoshi Kawamura
敬人志 河村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP60238196A priority Critical patent/JPS6298638A/ja
Publication of JPS6298638A publication Critical patent/JPS6298638A/ja
Publication of JPH0354858B2 publication Critical patent/JPH0354858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
JP60238196A 1985-10-24 1985-10-24 ダイボンデイング装置 Granted JPS6298638A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60238196A JPS6298638A (ja) 1985-10-24 1985-10-24 ダイボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60238196A JPS6298638A (ja) 1985-10-24 1985-10-24 ダイボンデイング装置

Publications (2)

Publication Number Publication Date
JPS6298638A true JPS6298638A (ja) 1987-05-08
JPH0354858B2 JPH0354858B2 (enExample) 1991-08-21

Family

ID=17026585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60238196A Granted JPS6298638A (ja) 1985-10-24 1985-10-24 ダイボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6298638A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0224549U (enExample) * 1988-07-29 1990-02-19
US4907790A (en) * 1987-12-15 1990-03-13 Kabushiki Kaisha Shinkawa Pellet-lifting apparatus
JPH0376139A (ja) * 1989-08-18 1991-04-02 Nec Corp 半導体素子突上げ方法
JPH04137043U (ja) * 1991-06-12 1992-12-21 山形日本電気株式会社 半導体ダイボンデイング装置のダイ突き上げ機構
US7238258B2 (en) * 2005-04-22 2007-07-03 Stats Chippac Ltd. System for peeling semiconductor chips from tape
US7445688B2 (en) * 2003-07-09 2008-11-04 Tdk Corporation Method and apparatus for picking up work piece and mounting machine
WO2009056469A1 (en) * 2007-10-31 2009-05-07 Oerlikon Assembly Equipment Ag, Steinhausen Foil perforating needle for detaching a small die from a foil
JP2010165835A (ja) * 2009-01-15 2010-07-29 Tdk Corp 電子部品のピックアップ方法及びピックアップ装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4907790A (en) * 1987-12-15 1990-03-13 Kabushiki Kaisha Shinkawa Pellet-lifting apparatus
JPH0224549U (enExample) * 1988-07-29 1990-02-19
JPH0376139A (ja) * 1989-08-18 1991-04-02 Nec Corp 半導体素子突上げ方法
JPH04137043U (ja) * 1991-06-12 1992-12-21 山形日本電気株式会社 半導体ダイボンデイング装置のダイ突き上げ機構
US7445688B2 (en) * 2003-07-09 2008-11-04 Tdk Corporation Method and apparatus for picking up work piece and mounting machine
US7238258B2 (en) * 2005-04-22 2007-07-03 Stats Chippac Ltd. System for peeling semiconductor chips from tape
WO2009056469A1 (en) * 2007-10-31 2009-05-07 Oerlikon Assembly Equipment Ag, Steinhausen Foil perforating needle for detaching a small die from a foil
JP2010165835A (ja) * 2009-01-15 2010-07-29 Tdk Corp 電子部品のピックアップ方法及びピックアップ装置

Also Published As

Publication number Publication date
JPH0354858B2 (enExample) 1991-08-21

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