JPS629734Y2 - - Google Patents

Info

Publication number
JPS629734Y2
JPS629734Y2 JP1978160851U JP16085178U JPS629734Y2 JP S629734 Y2 JPS629734 Y2 JP S629734Y2 JP 1978160851 U JP1978160851 U JP 1978160851U JP 16085178 U JP16085178 U JP 16085178U JP S629734 Y2 JPS629734 Y2 JP S629734Y2
Authority
JP
Japan
Prior art keywords
plating layer
semiconductor substrate
heat sink
resin
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1978160851U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5577846U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1978160851U priority Critical patent/JPS629734Y2/ja
Publication of JPS5577846U publication Critical patent/JPS5577846U/ja
Application granted granted Critical
Publication of JPS629734Y2 publication Critical patent/JPS629734Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H10W72/5363—
    • H10W72/884—
    • H10W74/00—
    • H10W90/734—

Landscapes

  • Die Bonding (AREA)
JP1978160851U 1978-11-22 1978-11-22 Expired JPS629734Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1978160851U JPS629734Y2 (enExample) 1978-11-22 1978-11-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978160851U JPS629734Y2 (enExample) 1978-11-22 1978-11-22

Publications (2)

Publication Number Publication Date
JPS5577846U JPS5577846U (enExample) 1980-05-29
JPS629734Y2 true JPS629734Y2 (enExample) 1987-03-06

Family

ID=29155021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978160851U Expired JPS629734Y2 (enExample) 1978-11-22 1978-11-22

Country Status (1)

Country Link
JP (1) JPS629734Y2 (enExample)

Also Published As

Publication number Publication date
JPS5577846U (enExample) 1980-05-29

Similar Documents

Publication Publication Date Title
US6093960A (en) Semiconductor package having a heat spreader capable of preventing being soldered and enhancing adhesion and electrical performance
KR930020649A (ko) 리이드프레임 및 그것을 사용한 반도체집적회로장치와 그 제조방법
JP4967701B2 (ja) 電力半導体装置
JPS629734Y2 (enExample)
US20010040300A1 (en) Semiconductor package with heat dissipation opening
JP2895504B2 (ja) 半導体装置
JPH0529529A (ja) 樹脂封止型半導体装置
JPS637029B2 (enExample)
JP3008242U (ja) 半導体ペレット搭載基板
JPS6020942Y2 (ja) 半導体装置
JP2003007933A (ja) 樹脂封止型半導体装置
JPH0778921A (ja) 半導体装置
JPH06112398A (ja) 樹脂封止型半導体装置
JPS635250Y2 (enExample)
JPH0357252A (ja) 樹脂封止型半導体装置
JP2009158825A (ja) 半導体装置
JP2755719B2 (ja) 樹脂封止型半導体装置の製造方法
JPS5986251A (ja) 樹脂封止型半導体装置用リ−ドフレ−ム
JPH04168753A (ja) 半導体装置
JPS6112682Y2 (enExample)
JPH0351977Y2 (enExample)
JPS607386B2 (ja) 半導体装置
KR0152941B1 (ko) 반도체 패키지
JPH0522391B2 (enExample)
TW402795B (en) Semiconductor device capable of avoiding the offset of the wire and its manufacturing method