JPS6280241A - 半導体素子のボンデイング用銅線 - Google Patents

半導体素子のボンデイング用銅線

Info

Publication number
JPS6280241A
JPS6280241A JP60219594A JP21959485A JPS6280241A JP S6280241 A JPS6280241 A JP S6280241A JP 60219594 A JP60219594 A JP 60219594A JP 21959485 A JP21959485 A JP 21959485A JP S6280241 A JPS6280241 A JP S6280241A
Authority
JP
Japan
Prior art keywords
bonding
copper wire
copper
ball
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60219594A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0564224B2 (cg-RX-API-DMAC10.html
Inventor
Taiyo Yamamoto
山本　太洋
Shinji Shirakawa
白川　信次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP60219594A priority Critical patent/JPS6280241A/ja
Publication of JPS6280241A publication Critical patent/JPS6280241A/ja
Publication of JPH0564224B2 publication Critical patent/JPH0564224B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent

Landscapes

  • Wire Bonding (AREA)
JP60219594A 1985-10-01 1985-10-01 半導体素子のボンデイング用銅線 Granted JPS6280241A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60219594A JPS6280241A (ja) 1985-10-01 1985-10-01 半導体素子のボンデイング用銅線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60219594A JPS6280241A (ja) 1985-10-01 1985-10-01 半導体素子のボンデイング用銅線

Publications (2)

Publication Number Publication Date
JPS6280241A true JPS6280241A (ja) 1987-04-13
JPH0564224B2 JPH0564224B2 (cg-RX-API-DMAC10.html) 1993-09-14

Family

ID=16737979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60219594A Granted JPS6280241A (ja) 1985-10-01 1985-10-01 半導体素子のボンデイング用銅線

Country Status (1)

Country Link
JP (1) JPS6280241A (cg-RX-API-DMAC10.html)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01159338A (ja) * 1987-12-15 1989-06-22 Fujikura Ltd 極細線用銅線材
JP2010062395A (ja) * 2008-09-04 2010-03-18 Sumitomo Metal Mining Co Ltd 銅ボンディングワイヤ
JP2010171235A (ja) * 2009-01-23 2010-08-05 Tanaka Electronics Ind Co Ltd 高純度Ｃｕボンディングワイヤ
US8004094B2 (en) 2006-08-31 2011-08-23 Nippon Steel Materials Co., Ltd. Copper alloy bonding wire for semiconductor device
JPWO2011129256A1 (ja) * 2010-04-14 2013-07-18 タツタ電線株式会社 ボンディングワイヤ
CN104994974A (zh) * 2013-01-11 2015-10-21 千住金属工业株式会社 铜球

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5678357U (cg-RX-API-DMAC10.html) * 1979-11-09 1981-06-25
JPS5929093A (ja) * 1982-08-10 1984-02-16 Power Reactor & Nuclear Fuel Dev Corp スケ−ルの除去方法
JPS59139663A (ja) * 1983-01-31 1984-08-10 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線
JPS6120693A (ja) * 1984-07-06 1986-01-29 Toshiba Corp ボンデイングワイヤ−
JPS61163194A (ja) * 1985-01-09 1986-07-23 Toshiba Corp 半導体素子用ボンデイング線

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5678357U (cg-RX-API-DMAC10.html) * 1979-11-09 1981-06-25
JPS5929093A (ja) * 1982-08-10 1984-02-16 Power Reactor & Nuclear Fuel Dev Corp スケ−ルの除去方法
JPS59139663A (ja) * 1983-01-31 1984-08-10 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線
JPS6120693A (ja) * 1984-07-06 1986-01-29 Toshiba Corp ボンデイングワイヤ−
JPS61163194A (ja) * 1985-01-09 1986-07-23 Toshiba Corp 半導体素子用ボンデイング線

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01159338A (ja) * 1987-12-15 1989-06-22 Fujikura Ltd 極細線用銅線材
US8004094B2 (en) 2006-08-31 2011-08-23 Nippon Steel Materials Co., Ltd. Copper alloy bonding wire for semiconductor device
US8610291B2 (en) * 2006-08-31 2013-12-17 Nippon Steel & Sumikin Materials Co., Ltd. Copper alloy bonding wire for semiconductor device
JP2010062395A (ja) * 2008-09-04 2010-03-18 Sumitomo Metal Mining Co Ltd 銅ボンディングワイヤ
JP2010171235A (ja) * 2009-01-23 2010-08-05 Tanaka Electronics Ind Co Ltd 高純度Ｃｕボンディングワイヤ
JPWO2011129256A1 (ja) * 2010-04-14 2013-07-18 タツタ電線株式会社 ボンディングワイヤ
CN104994974A (zh) * 2013-01-11 2015-10-21 千住金属工业株式会社 铜球

Also Published As

Publication number Publication date
JPH0564224B2 (cg-RX-API-DMAC10.html) 1993-09-14

Similar Documents

Publication Publication Date Title
US5550407A (en) Semiconductor device having an aluminum alloy wiring line
GB8828948D0 (en) Wire for bonding a semi-conductor device & process for producing same
JPS6280241A (ja) 半導体素子のボンデイング用銅線
KR970013143A (ko) 본딩용 금합금 세선 및 그 제조방법
JPS62127438A (ja) 半導体素子用ボンディング線
JPH0216580B2 (cg-RX-API-DMAC10.html)
SU1581763A1 (ru) Сплав на основе золота
JPS63211731A (ja) ボンデイング線
JP2656236B2 (ja) 半導体装置
JP2004514559A (ja) ぬれ性の改善された鉛非含有合金
US4357162A (en) Solder composition
JPH0555580B2 (cg-RX-API-DMAC10.html)
JPH08319525A (ja) ボンディングワイヤおよびその製造方法
JPH03255637A (ja) ダイボンディング用半田
JPS5816041A (ja) 高張力Ａｕ合金細線
JPS645460B2 (cg-RX-API-DMAC10.html)
JPH0464121B2 (cg-RX-API-DMAC10.html)
JPS645459B2 (cg-RX-API-DMAC10.html)
JPH0717976B2 (ja) 半導体装置
JP3147601B2 (ja) 高温強度に優れた半導体装置組立用Ｐｂ合金はんだ材
KR930002806B1 (ko) 반도체 소자의 본딩(bonding)용 금선(金線)
JP2656237B2 (ja) 半導体装置
JPS6353287A (ja) Ａｇ被覆導体
JPS63255336A (ja) ボンデイングワイヤ
JPH02219248A (ja) 半導体装置用銅ボンディングワイヤ