JPH0564224B2 - - Google Patents

Info

Publication number
JPH0564224B2
JPH0564224B2 JP60219594A JP21959485A JPH0564224B2 JP H0564224 B2 JPH0564224 B2 JP H0564224B2 JP 60219594 A JP60219594 A JP 60219594A JP 21959485 A JP21959485 A JP 21959485A JP H0564224 B2 JPH0564224 B2 JP H0564224B2
Authority
JP
Japan
Prior art keywords
wire
bonding
ppm
weight
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60219594A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6280241A (ja
Inventor
Taiyo Yamamoto
Shinji Shirakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP60219594A priority Critical patent/JPS6280241A/ja
Publication of JPS6280241A publication Critical patent/JPS6280241A/ja
Publication of JPH0564224B2 publication Critical patent/JPH0564224B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent

Landscapes

  • Wire Bonding (AREA)
JP60219594A 1985-10-01 1985-10-01 半導体素子のボンデイング用銅線 Granted JPS6280241A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60219594A JPS6280241A (ja) 1985-10-01 1985-10-01 半導体素子のボンデイング用銅線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60219594A JPS6280241A (ja) 1985-10-01 1985-10-01 半導体素子のボンデイング用銅線

Publications (2)

Publication Number Publication Date
JPS6280241A JPS6280241A (ja) 1987-04-13
JPH0564224B2 true JPH0564224B2 (cg-RX-API-DMAC10.html) 1993-09-14

Family

ID=16737979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60219594A Granted JPS6280241A (ja) 1985-10-01 1985-10-01 半導体素子のボンデイング用銅線

Country Status (1)

Country Link
JP (1) JPS6280241A (cg-RX-API-DMAC10.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01159338A (ja) * 1987-12-15 1989-06-22 Fujikura Ltd 極細線用銅線材
US8610291B2 (en) * 2006-08-31 2013-12-17 Nippon Steel & Sumikin Materials Co., Ltd. Copper alloy bonding wire for semiconductor device
JP5109881B2 (ja) * 2008-09-04 2012-12-26 住友金属鉱山株式会社 銅ボンディングワイヤ
JP4482605B1 (ja) * 2009-01-23 2010-06-16 田中電子工業株式会社 高純度Ｃｕボンディングワイヤ
WO2011129256A1 (ja) * 2010-04-14 2011-10-20 タツタ電線株式会社 ボンディングワイヤ
JP5447745B1 (ja) * 2013-01-11 2014-03-19 千住金属工業株式会社 Ｃｕボール

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5678357U (cg-RX-API-DMAC10.html) * 1979-11-09 1981-06-25
JPS5929093A (ja) * 1982-08-10 1984-02-16 Power Reactor & Nuclear Fuel Dev Corp スケ−ルの除去方法
JPS59139663A (ja) * 1983-01-31 1984-08-10 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線
JPS6120693A (ja) * 1984-07-06 1986-01-29 Toshiba Corp ボンデイングワイヤ−
JPS61163194A (ja) * 1985-01-09 1986-07-23 Toshiba Corp 半導体素子用ボンデイング線

Also Published As

Publication number Publication date
JPS6280241A (ja) 1987-04-13

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