JPS6270596A - 錫含有銅合金基材の銀メツキ方法 - Google Patents

錫含有銅合金基材の銀メツキ方法

Info

Publication number
JPS6270596A
JPS6270596A JP60207922A JP20792285A JPS6270596A JP S6270596 A JPS6270596 A JP S6270596A JP 60207922 A JP60207922 A JP 60207922A JP 20792285 A JP20792285 A JP 20792285A JP S6270596 A JPS6270596 A JP S6270596A
Authority
JP
Japan
Prior art keywords
plating
silver
tin
silver plating
copper alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60207922A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0256436B2 (enExample
Inventor
Takashi Uchida
喬 内田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP60207922A priority Critical patent/JPS6270596A/ja
Publication of JPS6270596A publication Critical patent/JPS6270596A/ja
Publication of JPH0256436B2 publication Critical patent/JPH0256436B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60207922A 1985-09-20 1985-09-20 錫含有銅合金基材の銀メツキ方法 Granted JPS6270596A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60207922A JPS6270596A (ja) 1985-09-20 1985-09-20 錫含有銅合金基材の銀メツキ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60207922A JPS6270596A (ja) 1985-09-20 1985-09-20 錫含有銅合金基材の銀メツキ方法

Publications (2)

Publication Number Publication Date
JPS6270596A true JPS6270596A (ja) 1987-04-01
JPH0256436B2 JPH0256436B2 (enExample) 1990-11-30

Family

ID=16547773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60207922A Granted JPS6270596A (ja) 1985-09-20 1985-09-20 錫含有銅合金基材の銀メツキ方法

Country Status (1)

Country Link
JP (1) JPS6270596A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63122254A (ja) * 1986-11-12 1988-05-26 Hitachi Cable Ltd 半導体装置用リ−ドフレ−ムの製造方法
JPH01306574A (ja) * 1988-06-06 1989-12-11 Furukawa Electric Co Ltd:The ＳｎまたはＳｎ合金被覆材料
JPH02301573A (ja) * 1989-05-15 1990-12-13 Furukawa Electric Co Ltd:The ＳｎまたはＳｎ合金被覆材料
JPH04221844A (ja) * 1990-12-21 1992-08-12 Mitsui High Tec Inc 半導体装置用リードフレームの製造方法
JP2002334960A (ja) * 2001-05-07 2002-11-22 Leadmikk Ltd 印字良好な放熱材

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6013078A (ja) * 1983-07-04 1985-01-23 Nippon Steel Corp ２層クロメ−ト処理鋼板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6013078A (ja) * 1983-07-04 1985-01-23 Nippon Steel Corp ２層クロメ−ト処理鋼板

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63122254A (ja) * 1986-11-12 1988-05-26 Hitachi Cable Ltd 半導体装置用リ−ドフレ−ムの製造方法
JPH01306574A (ja) * 1988-06-06 1989-12-11 Furukawa Electric Co Ltd:The ＳｎまたはＳｎ合金被覆材料
JPH02301573A (ja) * 1989-05-15 1990-12-13 Furukawa Electric Co Ltd:The ＳｎまたはＳｎ合金被覆材料
JPH04221844A (ja) * 1990-12-21 1992-08-12 Mitsui High Tec Inc 半導体装置用リードフレームの製造方法
JP2002334960A (ja) * 2001-05-07 2002-11-22 Leadmikk Ltd 印字良好な放熱材

Also Published As

Publication number Publication date
JPH0256436B2 (enExample) 1990-11-30

Similar Documents

Publication Publication Date Title
US5801436A (en) Lead frame for semiconductor device and process for producing the same
JP3481392B2 (ja) 電子部品リード部材及びその製造方法
TW201803065A (zh) 引線框架材及其製造方法
JPH04329891A (ja) 錫めっき銅合金材およびその製造方法
JPS6270596A (ja) 錫含有銅合金基材の銀メツキ方法
JPH10287994A (ja) ボンディング部のメッキ構造
JPH0253945B2 (enExample)
JP2925815B2 (ja) 半導体チップ実装用リードフレームとその製造方法
JPS6243343B2 (enExample)
JPS6372895A (ja) 電子・電気機器用部品の製造方法
JPH11111909A (ja) 半導体装置用リードフレーム
JPH01257356A (ja) 半導体用リードフレーム
JPH0391936A (ja) セラミックパッケージ
JPH10233121A (ja) リードワイヤ
JPS6036000B2 (ja) 耐熱銀被覆銅線およびその製造方法
JPS62199796A (ja) 電子・電気機器用部品
JPS5837922B2 (ja) 耐熱性配線用電気導体
JPS5882406A (ja) 銀又は銀合金被覆ダイオ−ドリ−ド線とその製造方法
JPH0534432B2 (enExample)
JPS6150160B2 (enExample)
US20250140661A1 (en) Lead frame, semiconductor package including the same, and method of manufacturing the lead frame
JPS6353287A (ja) Ａｇ被覆導体
JP2899549B2 (ja) ２層メッキのリード線とリードフレーム
JPH09223771A (ja) 電子部品用リード部材及びその製造方法
JP2944128B2 (ja) セラミックパッケージ

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term