JPH0256436B2 - - Google Patents

Info

Publication number
JPH0256436B2
JPH0256436B2 JP60207922A JP20792285A JPH0256436B2 JP H0256436 B2 JPH0256436 B2 JP H0256436B2 JP 60207922 A JP60207922 A JP 60207922A JP 20792285 A JP20792285 A JP 20792285A JP H0256436 B2 JPH0256436 B2 JP H0256436B2
Authority
JP
Japan
Prior art keywords
plating
silver plating
tin
silver
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60207922A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6270596A (ja
Inventor
Takashi Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP60207922A priority Critical patent/JPS6270596A/ja
Publication of JPS6270596A publication Critical patent/JPS6270596A/ja
Publication of JPH0256436B2 publication Critical patent/JPH0256436B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
JP60207922A 1985-09-20 1985-09-20 錫含有銅合金基材の銀メツキ方法 Granted JPS6270596A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60207922A JPS6270596A (ja) 1985-09-20 1985-09-20 錫含有銅合金基材の銀メツキ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60207922A JPS6270596A (ja) 1985-09-20 1985-09-20 錫含有銅合金基材の銀メツキ方法

Publications (2)

Publication Number Publication Date
JPS6270596A JPS6270596A (ja) 1987-04-01
JPH0256436B2 true JPH0256436B2 (enExample) 1990-11-30

Family

ID=16547773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60207922A Granted JPS6270596A (ja) 1985-09-20 1985-09-20 錫含有銅合金基材の銀メツキ方法

Country Status (1)

Country Link
JP (1) JPS6270596A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07123153B2 (ja) * 1986-11-12 1995-12-25 日立電線株式会社 半導体装置用リ−ドフレ−ムの製造方法
JP2726434B2 (ja) * 1988-06-06 1998-03-11 古河電気工業株式会社 ＳｎまたはＳｎ合金被覆材料
JP2670348B2 (ja) * 1989-05-15 1997-10-29 古河電気工業株式会社 ＳｎまたはＳｎ合金被覆材料
JP2525513B2 (ja) * 1990-12-21 1996-08-21 株式会社三井ハイテック 半導体装置用リ―ドフレ―ムの製造方法
JP2002334960A (ja) * 2001-05-07 2002-11-22 Leadmikk Ltd 印字良好な放熱材

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6013078A (ja) * 1983-07-04 1985-01-23 Nippon Steel Corp ２層クロメ−ト処理鋼板

Also Published As

Publication number Publication date
JPS6270596A (ja) 1987-04-01

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term