JPS626651B2 - - Google Patents
Info
- Publication number
- JPS626651B2 JPS626651B2 JP59192503A JP19250384A JPS626651B2 JP S626651 B2 JPS626651 B2 JP S626651B2 JP 59192503 A JP59192503 A JP 59192503A JP 19250384 A JP19250384 A JP 19250384A JP S626651 B2 JPS626651 B2 JP S626651B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- clamper
- bonding
- arm
- solenoid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/0711—
-
- H10W72/07141—
-
- H10W72/07168—
-
- H10W72/07502—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59192503A JPS6084829A (ja) | 1984-09-17 | 1984-09-17 | ワイヤボンデイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59192503A JPS6084829A (ja) | 1984-09-17 | 1984-09-17 | ワイヤボンデイング装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15649476A Division JPS5380967A (en) | 1976-12-27 | 1976-12-27 | Wire clamper driving mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6084829A JPS6084829A (ja) | 1985-05-14 |
| JPS626651B2 true JPS626651B2 (enExample) | 1987-02-12 |
Family
ID=16292382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59192503A Granted JPS6084829A (ja) | 1984-09-17 | 1984-09-17 | ワイヤボンデイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6084829A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4653681A (en) * | 1985-05-16 | 1987-03-31 | Kulicke And Soffa Industries, Inc. | Voice coil actuated fine wire clamp |
| DE102010037534A1 (de) | 2010-09-14 | 2012-03-15 | Thyssenkrupp Steel Europe Ag | Vorrichtung und Verfahren zur Herstellung von zumindest teilweise geschlossenen Hohlprofilen mit drehbaren Gesenkhälften und geringer Taktzeit |
-
1984
- 1984-09-17 JP JP59192503A patent/JPS6084829A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6084829A (ja) | 1985-05-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5067382A (en) | Method and apparatus for notching a lead wire attached to an IC chip to facilitate severing the wire | |
| JPH0245337B2 (enExample) | ||
| US7025243B2 (en) | Bondhead for wire bonding apparatus | |
| JPS626651B2 (enExample) | ||
| JPH04320350A (ja) | ワイヤボンデイング方法及び装置 | |
| JPH1052725A (ja) | 電子部品のリード折り曲げ方法及びその装置 | |
| EP0494510B1 (en) | Bonding head | |
| US5951283A (en) | Substrate transporting device | |
| JPS6084828A (ja) | ワイヤボンデイング方法 | |
| JPH08330795A (ja) | リード付き部品の装着装置 | |
| JP2004314079A (ja) | 自動機用はんだ付けヘッド | |
| JP2575066B2 (ja) | 半導体組立装置 | |
| JP3000817B2 (ja) | ワイヤボンディング方法 | |
| JP2885242B1 (ja) | ワイヤボンディング方法及び装置 | |
| JP2826233B2 (ja) | 基板搬送装置 | |
| JP2627968B2 (ja) | 半導体組立装置 | |
| JPH029555Y2 (enExample) | ||
| JPH0139212B2 (enExample) | ||
| JPS5988841A (ja) | ワイヤボンデイング装置 | |
| JPH09321074A (ja) | ワイヤボンディング装置 | |
| JP2725102B2 (ja) | ワイヤボンディング方法 | |
| JP4128321B2 (ja) | バンプボンディング装置 | |
| JP2663193B2 (ja) | 半導体組立装置並びにその方法 | |
| JPH06132345A (ja) | ワイヤボンディング装置 | |
| JPH0611066B2 (ja) | ワイヤボンデイング装置 |