JPH029555Y2 - - Google Patents
Info
- Publication number
- JPH029555Y2 JPH029555Y2 JP1984199363U JP19936384U JPH029555Y2 JP H029555 Y2 JPH029555 Y2 JP H029555Y2 JP 1984199363 U JP1984199363 U JP 1984199363U JP 19936384 U JP19936384 U JP 19936384U JP H029555 Y2 JPH029555 Y2 JP H029555Y2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- presser
- movable body
- lead frame
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/07141—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984199363U JPH029555Y2 (enExample) | 1984-12-28 | 1984-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984199363U JPH029555Y2 (enExample) | 1984-12-28 | 1984-12-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61114831U JPS61114831U (enExample) | 1986-07-19 |
| JPH029555Y2 true JPH029555Y2 (enExample) | 1990-03-09 |
Family
ID=30759216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984199363U Expired JPH029555Y2 (enExample) | 1984-12-28 | 1984-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH029555Y2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7715055B2 (ja) * | 2022-02-21 | 2025-07-30 | 三菱電機株式会社 | 半導体製造装置及び半導体製造方法 |
-
1984
- 1984-12-28 JP JP1984199363U patent/JPH029555Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61114831U (enExample) | 1986-07-19 |
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