JPS61114831U - - Google Patents
Info
- Publication number
- JPS61114831U JPS61114831U JP19936384U JP19936384U JPS61114831U JP S61114831 U JPS61114831 U JP S61114831U JP 19936384 U JP19936384 U JP 19936384U JP 19936384 U JP19936384 U JP 19936384U JP S61114831 U JPS61114831 U JP S61114831U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- presser
- moving body
- moving
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
- H01L2224/78344—Eccentric cams
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19936384U JPH029555Y2 (enExample) | 1984-12-28 | 1984-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19936384U JPH029555Y2 (enExample) | 1984-12-28 | 1984-12-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61114831U true JPS61114831U (enExample) | 1986-07-19 |
| JPH029555Y2 JPH029555Y2 (enExample) | 1990-03-09 |
Family
ID=30759216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19936384U Expired JPH029555Y2 (enExample) | 1984-12-28 | 1984-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH029555Y2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023121542A (ja) * | 2022-02-21 | 2023-08-31 | 三菱電機株式会社 | 半導体製造装置及び半導体製造方法 |
-
1984
- 1984-12-28 JP JP19936384U patent/JPH029555Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023121542A (ja) * | 2022-02-21 | 2023-08-31 | 三菱電機株式会社 | 半導体製造装置及び半導体製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH029555Y2 (enExample) | 1990-03-09 |
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