JPS6084829A - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS6084829A
JPS6084829A JP59192503A JP19250384A JPS6084829A JP S6084829 A JPS6084829 A JP S6084829A JP 59192503 A JP59192503 A JP 59192503A JP 19250384 A JP19250384 A JP 19250384A JP S6084829 A JPS6084829 A JP S6084829A
Authority
JP
Japan
Prior art keywords
wire
clamper
bonding
solenoid
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59192503A
Other languages
English (en)
Japanese (ja)
Other versions
JPS626651B2 (enExample
Inventor
Shunichiro Fujioka
俊一郎 藤岡
Shunei Uematsu
俊英 植松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59192503A priority Critical patent/JPS6084829A/ja
Publication of JPS6084829A publication Critical patent/JPS6084829A/ja
Publication of JPS626651B2 publication Critical patent/JPS626651B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/07168—
    • H10W72/07502—

Landscapes

  • Wire Bonding (AREA)
JP59192503A 1984-09-17 1984-09-17 ワイヤボンデイング装置 Granted JPS6084829A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59192503A JPS6084829A (ja) 1984-09-17 1984-09-17 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59192503A JPS6084829A (ja) 1984-09-17 1984-09-17 ワイヤボンデイング装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP15649476A Division JPS5380967A (en) 1976-12-27 1976-12-27 Wire clamper driving mechanism

Publications (2)

Publication Number Publication Date
JPS6084829A true JPS6084829A (ja) 1985-05-14
JPS626651B2 JPS626651B2 (enExample) 1987-02-12

Family

ID=16292382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59192503A Granted JPS6084829A (ja) 1984-09-17 1984-09-17 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6084829A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6231672A (ja) * 1985-05-16 1987-02-10 クリツケ・アンド・ソフア・インダストリ−ズ・インコ−ポレ−テツド ボイスコイルで駆動される細いワイヤ−結合ヘツド
US9993860B2 (en) 2010-09-14 2018-06-12 Thyssenkrupp Steel Europe Ag Device and method for producing at least partially closed hollow profiles with rotatable die halves and low cycle time

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6231672A (ja) * 1985-05-16 1987-02-10 クリツケ・アンド・ソフア・インダストリ−ズ・インコ−ポレ−テツド ボイスコイルで駆動される細いワイヤ−結合ヘツド
US9993860B2 (en) 2010-09-14 2018-06-12 Thyssenkrupp Steel Europe Ag Device and method for producing at least partially closed hollow profiles with rotatable die halves and low cycle time

Also Published As

Publication number Publication date
JPS626651B2 (enExample) 1987-02-12

Similar Documents

Publication Publication Date Title
EP0011979B1 (en) Processor-controlled drive apparatus for a semiconductor-wire bonder and method of operating same
US4340166A (en) High speed wire bonding method
US4053096A (en) Thermocompression welding device
US3328875A (en) Method of attaching conductors to terminals
JPS60189231A (ja) ワイヤボンデイング装置
US7025243B2 (en) Bondhead for wire bonding apparatus
US5249726A (en) Tape clamping mechanism
JPS6084829A (ja) ワイヤボンデイング装置
JPH04320350A (ja) ワイヤボンデイング方法及び装置
US5078312A (en) Wire bonding method
US4878609A (en) Apparatus for manual wire bonding
JPS6084828A (ja) ワイヤボンデイング方法
JP2575066B2 (ja) 半導体組立装置
JP2612465B2 (ja) 半導体フレームの供給方法
JP2627968B2 (ja) 半導体組立装置
JPH06291161A (ja) ワイヤボンディング装置
JPH0139212B2 (enExample)
JPS5988841A (ja) ワイヤボンデイング装置
JP2725102B2 (ja) ワイヤボンディング方法
JP2826233B2 (ja) 基板搬送装置
JPS5919462B2 (ja) ワイヤボンデイング装置
JPS63127543A (ja) ワイヤボンデイング装置
JPS63136536A (ja) ワイヤボンデイング方法
JPS6259460B2 (enExample)
JP2663193B2 (ja) 半導体組立装置並びにその方法