JPS626646B2 - - Google Patents

Info

Publication number
JPS626646B2
JPS626646B2 JP54056152A JP5615279A JPS626646B2 JP S626646 B2 JPS626646 B2 JP S626646B2 JP 54056152 A JP54056152 A JP 54056152A JP 5615279 A JP5615279 A JP 5615279A JP S626646 B2 JPS626646 B2 JP S626646B2
Authority
JP
Japan
Prior art keywords
wafer
boat
rotation
semiconductor
support rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54056152A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55148433A (en
Inventor
Fumio Shimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP5615279A priority Critical patent/JPS55148433A/ja
Publication of JPS55148433A publication Critical patent/JPS55148433A/ja
Publication of JPS626646B2 publication Critical patent/JPS626646B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP5615279A 1979-05-08 1979-05-08 Manufacture of semiconductor device and device therefor Granted JPS55148433A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5615279A JPS55148433A (en) 1979-05-08 1979-05-08 Manufacture of semiconductor device and device therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5615279A JPS55148433A (en) 1979-05-08 1979-05-08 Manufacture of semiconductor device and device therefor

Publications (2)

Publication Number Publication Date
JPS55148433A JPS55148433A (en) 1980-11-19
JPS626646B2 true JPS626646B2 (enrdf_load_stackoverflow) 1987-02-12

Family

ID=13019109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5615279A Granted JPS55148433A (en) 1979-05-08 1979-05-08 Manufacture of semiconductor device and device therefor

Country Status (1)

Country Link
JP (1) JPS55148433A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57138130A (en) * 1981-02-20 1982-08-26 Fujitsu Ltd Diffusion treatment method
US5180150A (en) * 1992-01-24 1993-01-19 Hughes Danbury Optical Systems, Inc. Apparatus for providing consistent registration of semiconductor wafers

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4834670A (enrdf_load_stackoverflow) * 1971-09-07 1973-05-21
GB1502754A (en) * 1975-12-22 1978-03-01 Siemens Ag Heat-treatment of semi-conductor wafers

Also Published As

Publication number Publication date
JPS55148433A (en) 1980-11-19

Similar Documents

Publication Publication Date Title
JP3151118B2 (ja) 熱処理装置
US5431561A (en) Method and apparatus for heat treating
US3737282A (en) Method for reducing crystallographic defects in semiconductor structures
JP3504784B2 (ja) 熱処理方法
JP3242281B2 (ja) 熱処理装置
KR0139816B1 (ko) 열처리 장치 및 열처리 방법
JPS626646B2 (enrdf_load_stackoverflow)
JP3138291B2 (ja) 半導体ウエハの熱処理方法
JPH1098048A (ja) ウエハー熱処理装置
JPS589579B2 (ja) ハンドウタイソウチノ セイゾウソウチ
JPS6081819A (ja) 赤外線熱処理装置
JPH03164688A (ja) 縦型熱処理装置
JP7230661B2 (ja) シリコンウェーハのスリップ転位に対する耐性の評価方法
JP3464505B2 (ja) 熱処理方法
JPH07326593A (ja) 熱処理装置及び熱処理方法
JP2693465B2 (ja) 半導体ウェハの処理装置
JPS6112674Y2 (enrdf_load_stackoverflow)
JPH11106287A (ja) 半導体ウエハ処理方法及び装置
JPH11154649A (ja) 急速熱処理装置
JP2748325B2 (ja) 半導体ウェハの加熱処理方法
KR20240137241A (ko) 웨이퍼 열처리 장치
JPH1154445A (ja) 半導体デバイス製造方法および製造装置
KR100275366B1 (ko) 다수의 기판홀더를 포함한 열벽증착기
JPH0878350A (ja) 半導体熱処理装置
JPH11251256A (ja) 半導体ウエハ熱処理装置