GB1502754A - Heat-treatment of semi-conductor wafers - Google Patents

Heat-treatment of semi-conductor wafers

Info

Publication number
GB1502754A
GB1502754A GB39644/76A GB3964476A GB1502754A GB 1502754 A GB1502754 A GB 1502754A GB 39644/76 A GB39644/76 A GB 39644/76A GB 3964476 A GB3964476 A GB 3964476A GB 1502754 A GB1502754 A GB 1502754A
Authority
GB
United Kingdom
Prior art keywords
wafers
heat
tube
treatment
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB39644/76A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19752558041 external-priority patent/DE2558041C3/en
Priority claimed from DE19762619444 external-priority patent/DE2619444C2/en
Priority claimed from DE19762629951 external-priority patent/DE2629951C2/en
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB1502754A publication Critical patent/GB1502754A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
    • C30B31/14—Substrate holders or susceptors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G33/00—Screw or rotary spiral conveyors
    • B65G33/02—Screw or rotary spiral conveyors for articles
    • B65G33/06—Screw or rotary spiral conveyors for articles conveyed and guided by parallel screws
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
    • C30B31/10—Reaction chambers; Selection of materials therefor
    • C30B31/106—Continuous processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

1502754 Screw conveyers SIEMENS AG 24 Sept 1976 [22 Dec 1975 3 May 1976 2 July 1976] 39644/76 Heading B8A [Also in Division H1] In a method of heat-treating semi-conductor wafers 4, during the heat-treatment, the wafers are successively conveyed through a furnace tube 1 by means of rotating rods 2, 9 provided with helical grooves (3), Fig. 3 (not shown), of the same pitch to receive the edges of the wafers. The ends 2, 9 typically of silicon, and projecting beyond the ends of the tube 1 of quartz or silicon, may have grooves varying in pitch along their lengths so as to provide, e.g., higher transfer rate of silicon wafers at the ends of the tube. The tube 1 may be of a rectangular cross-section. It is stated that the method enables uniform heat-treatment of the wafers by providing a constant temperature-time characteristic.
GB39644/76A 1975-12-22 1976-09-24 Heat-treatment of semi-conductor wafers Expired GB1502754A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19752558041 DE2558041C3 (en) 1975-12-22 1975-12-22 Method for transporting semiconductor wafers through a temperature treatment tube
DE19762619444 DE2619444C2 (en) 1975-12-22 1976-05-03 Device for carrying out a method for transporting semiconductor wafers
DE19762629951 DE2629951C2 (en) 1975-12-22 1976-07-02 Method for transporting semiconductor wafers through a temperature treatment tube

Publications (1)

Publication Number Publication Date
GB1502754A true GB1502754A (en) 1978-03-01

Family

ID=27186673

Family Applications (1)

Application Number Title Priority Date Filing Date
GB39644/76A Expired GB1502754A (en) 1975-12-22 1976-09-24 Heat-treatment of semi-conductor wafers

Country Status (4)

Country Link
JP (1) JPS5277674A (en)
FR (1) FR2336796A1 (en)
GB (1) GB1502754A (en)
IT (1) IT1067293B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55148433A (en) * 1979-05-08 1980-11-19 Nec Corp Manufacture of semiconductor device and device therefor

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1342183A (en) * 1919-12-29 1920-06-01 Ransom George Hardiman Wind-screen for use on conveyances and like purposes
GB1282322A (en) * 1968-08-29 1972-07-19 Texas Instruments Inc Continuous deposition system
DE1801187B1 (en) * 1968-10-04 1970-04-16 Siemens Ag Device for the heat treatment of silicon wafers
US3602192A (en) * 1969-05-19 1971-08-31 Ibm Semiconductor wafer processing
US3638927A (en) * 1969-08-01 1972-02-01 Texas Instruments Inc Slice conveyor furnace
NL7206014A (en) * 1971-07-07 1973-01-09
US3772756A (en) * 1972-02-23 1973-11-20 Concep Machine Co Inc Core handling system
DE2235342A1 (en) * 1972-07-19 1974-01-31 Siemens Ag DIFFUSION PIPE FOR DOPING SEMICONDUCTOR DISCS
DE2357319B2 (en) * 1973-11-16 1976-05-26 Denki Kagaku Kogyo K.K., Tokio DISC-SHAPED PHOSPHORUS DOPERANT SOURCE AND METHOD FOR MANUFACTURING IT
DE2411142A1 (en) * 1974-03-08 1975-10-09 Bosch Gmbh Robert Cop vessel sterilising equipment - transports through spray and drier by spiral grooved spindles accommodating vessel flanges

Also Published As

Publication number Publication date
JPS5277674A (en) 1977-06-30
FR2336796A1 (en) 1977-07-22
FR2336796B1 (en) 1983-01-21
IT1067293B (en) 1985-03-16

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee