JPS55148433A - Manufacture of semiconductor device and device therefor - Google Patents
Manufacture of semiconductor device and device thereforInfo
- Publication number
- JPS55148433A JPS55148433A JP5615279A JP5615279A JPS55148433A JP S55148433 A JPS55148433 A JP S55148433A JP 5615279 A JP5615279 A JP 5615279A JP 5615279 A JP5615279 A JP 5615279A JP S55148433 A JPS55148433 A JP S55148433A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- supporting rods
- rotating
- heat treatment
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 238000010438 heat treatment Methods 0.000 abstract 3
- 238000009792 diffusion process Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5615279A JPS55148433A (en) | 1979-05-08 | 1979-05-08 | Manufacture of semiconductor device and device therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5615279A JPS55148433A (en) | 1979-05-08 | 1979-05-08 | Manufacture of semiconductor device and device therefor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55148433A true JPS55148433A (en) | 1980-11-19 |
JPS626646B2 JPS626646B2 (ja) | 1987-02-12 |
Family
ID=13019109
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5615279A Granted JPS55148433A (en) | 1979-05-08 | 1979-05-08 | Manufacture of semiconductor device and device therefor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55148433A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57138130A (en) * | 1981-02-20 | 1982-08-26 | Fujitsu Ltd | Diffusion treatment method |
US5180150A (en) * | 1992-01-24 | 1993-01-19 | Hughes Danbury Optical Systems, Inc. | Apparatus for providing consistent registration of semiconductor wafers |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4834670A (ja) * | 1971-09-07 | 1973-05-21 | ||
JPS5277674A (en) * | 1975-12-22 | 1977-06-30 | Siemens Ag | Method of heat treatment for semiconductor board |
-
1979
- 1979-05-08 JP JP5615279A patent/JPS55148433A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4834670A (ja) * | 1971-09-07 | 1973-05-21 | ||
JPS5277674A (en) * | 1975-12-22 | 1977-06-30 | Siemens Ag | Method of heat treatment for semiconductor board |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57138130A (en) * | 1981-02-20 | 1982-08-26 | Fujitsu Ltd | Diffusion treatment method |
US5180150A (en) * | 1992-01-24 | 1993-01-19 | Hughes Danbury Optical Systems, Inc. | Apparatus for providing consistent registration of semiconductor wafers |
Also Published As
Publication number | Publication date |
---|---|
JPS626646B2 (ja) | 1987-02-12 |
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