JPS6262468B2 - - Google Patents
Info
- Publication number
- JPS6262468B2 JPS6262468B2 JP55034463A JP3446380A JPS6262468B2 JP S6262468 B2 JPS6262468 B2 JP S6262468B2 JP 55034463 A JP55034463 A JP 55034463A JP 3446380 A JP3446380 A JP 3446380A JP S6262468 B2 JPS6262468 B2 JP S6262468B2
- Authority
- JP
- Japan
- Prior art keywords
- gate
- melting point
- film
- high melting
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/665—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of elemental metal contacting the insulator, e.g. tungsten or molybdenum
- H10D64/666—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of elemental metal contacting the insulator, e.g. tungsten or molybdenum the conductor further comprising additional layers
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3446380A JPS56130948A (en) | 1980-03-18 | 1980-03-18 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3446380A JPS56130948A (en) | 1980-03-18 | 1980-03-18 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56130948A JPS56130948A (en) | 1981-10-14 |
JPS6262468B2 true JPS6262468B2 (enrdf_load_stackoverflow) | 1987-12-26 |
Family
ID=12414937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3446380A Granted JPS56130948A (en) | 1980-03-18 | 1980-03-18 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56130948A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02260690A (ja) * | 1989-03-31 | 1990-10-23 | Matsushita Electric Ind Co Ltd | プリント基板の部品取付け装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0697667B2 (ja) * | 1983-10-21 | 1994-11-30 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
JPS6154648A (ja) * | 1984-08-24 | 1986-03-18 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
JPH025477A (ja) * | 1988-06-23 | 1990-01-10 | Fujitsu Ltd | 半導体装置及びその製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5365088A (en) * | 1976-11-22 | 1978-06-10 | Nec Corp | Semiconductor device |
-
1980
- 1980-03-18 JP JP3446380A patent/JPS56130948A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02260690A (ja) * | 1989-03-31 | 1990-10-23 | Matsushita Electric Ind Co Ltd | プリント基板の部品取付け装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS56130948A (en) | 1981-10-14 |
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