JPS6259887B2 - - Google Patents

Info

Publication number
JPS6259887B2
JPS6259887B2 JP57176525A JP17652582A JPS6259887B2 JP S6259887 B2 JPS6259887 B2 JP S6259887B2 JP 57176525 A JP57176525 A JP 57176525A JP 17652582 A JP17652582 A JP 17652582A JP S6259887 B2 JPS6259887 B2 JP S6259887B2
Authority
JP
Japan
Prior art keywords
cap
flip chip
metal plate
adhesive
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57176525A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5965458A (ja
Inventor
Masanobu Obara
Hiroshi Shibata
Shin Nakao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57176525A priority Critical patent/JPS5965458A/ja
Priority to US06/534,840 priority patent/US4561011A/en
Publication of JPS5965458A publication Critical patent/JPS5965458A/ja
Priority to US06/783,537 priority patent/US4654966A/en
Publication of JPS6259887B2 publication Critical patent/JPS6259887B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/22—
    • H10W40/611—
    • H10W40/77—
    • H10W40/231—
    • H10W40/233—
    • H10W40/242—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/877—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP57176525A 1982-10-05 1982-10-05 半導体装置の製造方法 Granted JPS5965458A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP57176525A JPS5965458A (ja) 1982-10-05 1982-10-05 半導体装置の製造方法
US06/534,840 US4561011A (en) 1982-10-05 1983-09-22 Dimensionally stable semiconductor device
US06/783,537 US4654966A (en) 1982-10-05 1985-10-03 Method of making a dimensionally stable semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57176525A JPS5965458A (ja) 1982-10-05 1982-10-05 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5965458A JPS5965458A (ja) 1984-04-13
JPS6259887B2 true JPS6259887B2 (enExample) 1987-12-14

Family

ID=16015133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57176525A Granted JPS5965458A (ja) 1982-10-05 1982-10-05 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5965458A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0754838B2 (ja) * 1987-01-08 1995-06-07 富士通株式会社 半導体装置
DE69117891T2 (de) * 1990-11-20 1996-07-25 Sumitomo Electric Industries Verfahren zum Montieren von Halbleiterelementen
JP3241639B2 (ja) 1997-06-30 2001-12-25 日本電気株式会社 マルチチップモジュールの冷却構造およびその製造方法
US7042084B2 (en) * 2002-01-02 2006-05-09 Intel Corporation Semiconductor package with integrated heat spreader attached to a thermally conductive substrate core

Also Published As

Publication number Publication date
JPS5965458A (ja) 1984-04-13

Similar Documents

Publication Publication Date Title
US4654966A (en) Method of making a dimensionally stable semiconductor device
JP3097644B2 (ja) 半導体装置接続構造及び接続方法
US6111322A (en) Semiconductor device and manufacturing method thereof
WO2023032462A1 (ja) 半導体装置およびその製造方法
JPH0823002A (ja) 半導体装置及びその製造方法
JP7794027B2 (ja) 半導体装置の製造方法
JPS6259887B2 (enExample)
JP4380442B2 (ja) 半導体装置の製造方法
JPH11121662A (ja) 半導体装置の冷却構造
JPS5965457A (ja) 半導体装置
JP3192507B2 (ja) 樹脂シール中空型半導体装置の製造方法
EP0525651B1 (en) Package structure for one or more IC chips
JPH0513603A (ja) 半導体集積回路装置
JPH11111897A (ja) マルチチップ型半導体装置
JPH0473955A (ja) 半導体装置及びその製造方法
JPH01191453A (ja) 半導体装置
JPH03108361A (ja) 半導体集積回路装置
JP2868868B2 (ja) 半導体装置
JPS5946051A (ja) 絶縁型半導体装置
JPH0349398Y2 (enExample)
JPS59884A (ja) 熱圧着装置
JPH11145194A (ja) フリップチップの実装方法および実装構造
JPH07273240A (ja) 樹脂封止形半導体装置
JPS6155945A (ja) フラツトパツケ−ジのキヤツプシ−ル方法
JPS62281452A (ja) 半導体モジユ−ル