JPS62580B2 - - Google Patents
Info
- Publication number
- JPS62580B2 JPS62580B2 JP53054498A JP5449878A JPS62580B2 JP S62580 B2 JPS62580 B2 JP S62580B2 JP 53054498 A JP53054498 A JP 53054498A JP 5449878 A JP5449878 A JP 5449878A JP S62580 B2 JPS62580 B2 JP S62580B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- frame member
- frame
- glass plate
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 22
- 239000011521 glass Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 9
- 238000003466 welding Methods 0.000 claims description 9
- 238000005219 brazing Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000008188 pellet Substances 0.000 claims 5
- 239000010410 layer Substances 0.000 description 28
- 238000000034 method Methods 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 238000007789 sealing Methods 0.000 description 7
- 238000003384 imaging method Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 5
- 239000010937 tungsten Substances 0.000 description 5
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 229910000833 kovar Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910017944 Ag—Cu Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000004859 Copal Substances 0.000 description 1
- 241000782205 Guibourtia conjugata Species 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Non-Volatile Memory (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5449878A JPS54146985A (en) | 1978-05-10 | 1978-05-10 | Package for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5449878A JPS54146985A (en) | 1978-05-10 | 1978-05-10 | Package for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54146985A JPS54146985A (en) | 1979-11-16 |
| JPS62580B2 true JPS62580B2 (US06521211-20030218-C00004.png) | 1987-01-08 |
Family
ID=12972291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5449878A Granted JPS54146985A (en) | 1978-05-10 | 1978-05-10 | Package for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54146985A (US06521211-20030218-C00004.png) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57192177A (en) * | 1981-05-22 | 1982-11-26 | Hitachi Ltd | Solid-state image pickup device |
| JPS5812479A (ja) * | 1981-07-15 | 1983-01-24 | Hitachi Ltd | 固体撮像装置 |
| JPS5812478A (ja) * | 1981-07-15 | 1983-01-24 | Hitachi Ltd | 固体撮像装置の製造方法 |
| JPS58140155A (ja) * | 1982-02-16 | 1983-08-19 | Canon Inc | 固体撮像装置 |
| JPS59140443U (ja) * | 1983-03-08 | 1984-09-19 | 新光電気工業株式会社 | 半導体装置用透光性キヤツプ |
| JPS61112370A (ja) * | 1984-11-07 | 1986-05-30 | Nec Corp | パツケ−ジ |
| JPH0732208B2 (ja) * | 1989-10-31 | 1995-04-10 | 三菱電機株式会社 | 半導体装置 |
-
1978
- 1978-05-10 JP JP5449878A patent/JPS54146985A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54146985A (en) | 1979-11-16 |
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