JPS6257106B2 - - Google Patents

Info

Publication number
JPS6257106B2
JPS6257106B2 JP55175608A JP17560880A JPS6257106B2 JP S6257106 B2 JPS6257106 B2 JP S6257106B2 JP 55175608 A JP55175608 A JP 55175608A JP 17560880 A JP17560880 A JP 17560880A JP S6257106 B2 JPS6257106 B2 JP S6257106B2
Authority
JP
Japan
Prior art keywords
coating layer
aluminum coating
lead frame
etching
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55175608A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5799763A (en
Inventor
Kenji Konishi
Mamoru Onda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP17560880A priority Critical patent/JPS5799763A/ja
Publication of JPS5799763A publication Critical patent/JPS5799763A/ja
Publication of JPS6257106B2 publication Critical patent/JPS6257106B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4828—Etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP17560880A 1980-12-12 1980-12-12 Manufacture of lead frame for integrated circuit Granted JPS5799763A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17560880A JPS5799763A (en) 1980-12-12 1980-12-12 Manufacture of lead frame for integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17560880A JPS5799763A (en) 1980-12-12 1980-12-12 Manufacture of lead frame for integrated circuit

Publications (2)

Publication Number Publication Date
JPS5799763A JPS5799763A (en) 1982-06-21
JPS6257106B2 true JPS6257106B2 (enrdf_load_stackoverflow) 1987-11-30

Family

ID=15999063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17560880A Granted JPS5799763A (en) 1980-12-12 1980-12-12 Manufacture of lead frame for integrated circuit

Country Status (1)

Country Link
JP (1) JPS5799763A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6372889A (ja) * 1986-09-12 1988-04-02 Showa Alum Corp リ−ドフレ−ムの製造方法
JPS63160367A (ja) * 1986-12-24 1988-07-04 Hitachi Ltd 樹脂封止型半導体装置
DE10348715B4 (de) 2003-10-16 2006-05-04 Infineon Technologies Ag Verfahren zum Herstellen eines Flachleiterrahmens mit verbesserter Haftung zwischen diesem und Kunststoff sowie Flachleiterrahmen

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4952976A (enrdf_load_stackoverflow) * 1972-09-22 1974-05-23
JPS553642A (en) * 1978-06-23 1980-01-11 Hitachi Ltd Manufacturing semiconductor device

Also Published As

Publication number Publication date
JPS5799763A (en) 1982-06-21

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