JPS553642A - Manufacturing semiconductor device - Google Patents

Manufacturing semiconductor device

Info

Publication number
JPS553642A
JPS553642A JP7537778A JP7537778A JPS553642A JP S553642 A JPS553642 A JP S553642A JP 7537778 A JP7537778 A JP 7537778A JP 7537778 A JP7537778 A JP 7537778A JP S553642 A JPS553642 A JP S553642A
Authority
JP
Japan
Prior art keywords
lead
leads
frame
lead frame
solders
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7537778A
Other languages
Japanese (ja)
Inventor
Fumihito Inoue
Kazuo Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7537778A priority Critical patent/JPS553642A/en
Publication of JPS553642A publication Critical patent/JPS553642A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To eliminate the Ag migration problem and secure an excellent connecting property of solders by covering Al on a lead frame, and by removing A l from the surfaces of the protruded leads after forming semiconductor elements and sealing them by insulators. CONSTITUTION:An Al cover 2 is formed on the surface of a plate material 1 of phosphor bronze and the like. Then, a continuous lead frame body 3 having a plurality of lead-frame patterns are made. After that, a semiconductor element 4 is formed on the Al formation of the lead frame. Then, the semiconductor element and inner leads are molded by epoxy resin 5 and the like in such a way they are enclosed. Thereafter, the continuous frame is cut into individual units, unnecessary portions between the leads are removed, and leads 6 are bent in one direction. Then Al on the lead surface protruded from the mask of the resinous seal 5 is removed. As a result Ag migration problem is eliminated by forming the Al film on the bonding portion, and excellent connecting property of solders at the lead portion is secured.
JP7537778A 1978-06-23 1978-06-23 Manufacturing semiconductor device Pending JPS553642A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7537778A JPS553642A (en) 1978-06-23 1978-06-23 Manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7537778A JPS553642A (en) 1978-06-23 1978-06-23 Manufacturing semiconductor device

Publications (1)

Publication Number Publication Date
JPS553642A true JPS553642A (en) 1980-01-11

Family

ID=13574441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7537778A Pending JPS553642A (en) 1978-06-23 1978-06-23 Manufacturing semiconductor device

Country Status (1)

Country Link
JP (1) JPS553642A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5799763A (en) * 1980-12-12 1982-06-21 Hitachi Cable Ltd Manufacture of lead frame for integrated circuit
JPS5925257A (en) * 1982-07-30 1984-02-09 Shinko Electric Ind Co Ltd Manufacture of lead frame for low melting-point glass seal type semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51112273A (en) * 1975-03-28 1976-10-04 Hitachi Ltd Lead frame for resin mold type semiconductor device
JPS51137375A (en) * 1975-05-22 1976-11-27 Mitsubishi Electric Corp Semi conductor device
JPS5464467A (en) * 1977-10-31 1979-05-24 Nippon Paint Co Ltd Electronic part

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51112273A (en) * 1975-03-28 1976-10-04 Hitachi Ltd Lead frame for resin mold type semiconductor device
JPS51137375A (en) * 1975-05-22 1976-11-27 Mitsubishi Electric Corp Semi conductor device
JPS5464467A (en) * 1977-10-31 1979-05-24 Nippon Paint Co Ltd Electronic part

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5799763A (en) * 1980-12-12 1982-06-21 Hitachi Cable Ltd Manufacture of lead frame for integrated circuit
JPS6257106B2 (en) * 1980-12-12 1987-11-30 Hitachi Cable
JPS5925257A (en) * 1982-07-30 1984-02-09 Shinko Electric Ind Co Ltd Manufacture of lead frame for low melting-point glass seal type semiconductor device

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