JPS6248386B2 - - Google Patents
Info
- Publication number
- JPS6248386B2 JPS6248386B2 JP16459881A JP16459881A JPS6248386B2 JP S6248386 B2 JPS6248386 B2 JP S6248386B2 JP 16459881 A JP16459881 A JP 16459881A JP 16459881 A JP16459881 A JP 16459881A JP S6248386 B2 JPS6248386 B2 JP S6248386B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- spot
- lead frame
- manufacturing
- masking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 22
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 230000000873 masking effect Effects 0.000 claims description 7
- 238000004080 punching Methods 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000010019 resist printing Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 238000002844 melting Methods 0.000 description 6
- 239000010970 precious metal Substances 0.000 description 6
- 238000007789 sealing Methods 0.000 description 5
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 229910000640 Fe alloy Inorganic materials 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002241 glass-ceramic Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 229910003271 Ni-Fe Inorganic materials 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4828—Etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16459881A JPS5864057A (ja) | 1981-10-14 | 1981-10-14 | Ａｌスポツトリ−ドフレ−ムの製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16459881A JPS5864057A (ja) | 1981-10-14 | 1981-10-14 | Ａｌスポツトリ−ドフレ−ムの製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5864057A JPS5864057A (ja) | 1983-04-16 |
| JPS6248386B2 true JPS6248386B2 (enrdf_load_stackoverflow) | 1987-10-13 |
Family
ID=15796215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16459881A Granted JPS5864057A (ja) | 1981-10-14 | 1981-10-14 | Ａｌスポツトリ−ドフレ−ムの製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5864057A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63167747U (enrdf_load_stackoverflow) * | 1987-04-21 | 1988-11-01 | ||
| JPS63265453A (ja) * | 1987-04-22 | 1988-11-01 | Mitsubishi Electric Corp | 半導体用リ−ドフレ−ムの製造方法 |
-
1981
- 1981-10-14 JP JP16459881A patent/JPS5864057A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5864057A (ja) | 1983-04-16 |
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