JPS6252947B2 - - Google Patents

Info

Publication number
JPS6252947B2
JPS6252947B2 JP55146301A JP14630180A JPS6252947B2 JP S6252947 B2 JPS6252947 B2 JP S6252947B2 JP 55146301 A JP55146301 A JP 55146301A JP 14630180 A JP14630180 A JP 14630180A JP S6252947 B2 JPS6252947 B2 JP S6252947B2
Authority
JP
Japan
Prior art keywords
plating
copper foil
finger
resist
device hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55146301A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5771159A (en
Inventor
Yoshihiro Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP55146301A priority Critical patent/JPS5771159A/ja
Publication of JPS5771159A publication Critical patent/JPS5771159A/ja
Publication of JPS6252947B2 publication Critical patent/JPS6252947B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/453
    • H10W70/04

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
JP55146301A 1980-10-21 1980-10-21 Heterogeneous electroplating method for circuit substrate Granted JPS5771159A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55146301A JPS5771159A (en) 1980-10-21 1980-10-21 Heterogeneous electroplating method for circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55146301A JPS5771159A (en) 1980-10-21 1980-10-21 Heterogeneous electroplating method for circuit substrate

Publications (2)

Publication Number Publication Date
JPS5771159A JPS5771159A (en) 1982-05-01
JPS6252947B2 true JPS6252947B2 (OSRAM) 1987-11-07

Family

ID=15404578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55146301A Granted JPS5771159A (en) 1980-10-21 1980-10-21 Heterogeneous electroplating method for circuit substrate

Country Status (1)

Country Link
JP (1) JPS5771159A (OSRAM)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987000938A1 (en) * 1985-08-08 1987-02-12 Macdermid, Incorporated Method for manufacture of printed circuit boards

Also Published As

Publication number Publication date
JPS5771159A (en) 1982-05-01

Similar Documents

Publication Publication Date Title
US3960561A (en) Method for making electrical lead frame devices
JP3341311B2 (ja) フレキシブル配線板およびその製造方法
US4597177A (en) Fabricating contacts for flexible module carriers
JPS6127697A (ja) 片面プリント配線基板とその製造法
JPS6252947B2 (OSRAM)
US6007729A (en) Carrier tape and manufacturing method of said carrier tape
JPS61212089A (ja) プリント配線基板
JP3624512B2 (ja) 電子部品搭載用基板の製造方法
JP3187767B2 (ja) フィルムキャリアテープ
JPH0673391B2 (ja) フレキシブル両面回路基板の製造方法
JPH10126056A (ja) プリント配線基板の製造方法
JP3808226B2 (ja) 電子部品実装用フィルムキャリアテープ
JPH01173694A (ja) 両面スルホールフィルムキャリアの製造方法
JPH0373593A (ja) フレキシブルプリント配線板の製造方法
JPS6225491A (ja) 印刷配線板の製法
JPS61284991A (ja) アルミニウム/銅複合箔張基板の回路形成法
JP2957747B2 (ja) 回路部品搭載用端子を備えた回路基板の製造法
JP3197929B2 (ja) 多層プリント配線板の製造方法
JPS58162092A (ja) 硬質板付きフレキシブル印刷配線板の製造方法
JPH04102341A (ja) Tabテープの製造方法
JPH04338656A (ja) チップキャリアおよびその製造方法
JPS6074596A (ja) 電子部品搭載基板の製造方法
JPH04144191A (ja) クリームはんだ印刷用メタルマスク
JPH01278798A (ja) リジッドフレキシブル配線板の製造方法
JPS60208895A (ja) プリント配線板の製造方法