JPS6251493B2 - - Google Patents

Info

Publication number
JPS6251493B2
JPS6251493B2 JP57181945A JP18194582A JPS6251493B2 JP S6251493 B2 JPS6251493 B2 JP S6251493B2 JP 57181945 A JP57181945 A JP 57181945A JP 18194582 A JP18194582 A JP 18194582A JP S6251493 B2 JPS6251493 B2 JP S6251493B2
Authority
JP
Japan
Prior art keywords
resin
defoaming
air bubbles
molding resin
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57181945A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5969936A (ja
Inventor
Hiroshi Kiryama
Kazuo Yuikawa
Hironori Nakano
Mitsuhiro Nakagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP57181945A priority Critical patent/JPS5969936A/ja
Publication of JPS5969936A publication Critical patent/JPS5969936A/ja
Publication of JPS6251493B2 publication Critical patent/JPS6251493B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP57181945A 1982-10-15 1982-10-15 半導体装置の製造方法 Granted JPS5969936A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57181945A JPS5969936A (ja) 1982-10-15 1982-10-15 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57181945A JPS5969936A (ja) 1982-10-15 1982-10-15 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5969936A JPS5969936A (ja) 1984-04-20
JPS6251493B2 true JPS6251493B2 (enrdf_load_stackoverflow) 1987-10-30

Family

ID=16109624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57181945A Granted JPS5969936A (ja) 1982-10-15 1982-10-15 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5969936A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3775081B2 (ja) * 1998-11-27 2006-05-17 松下電器産業株式会社 半導体発光装置
JP4223743B2 (ja) * 2002-06-26 2009-02-12 光寶科技股▲分▼有限公司 カラーセクションディスプレイユニットの製造方法
JP2004267947A (ja) * 2003-03-10 2004-09-30 Tohoku Ricoh Co Ltd 光触媒装置
WO2007018039A1 (ja) 2005-08-05 2007-02-15 Matsushita Electric Industrial Co., Ltd. 半導体発光装置

Also Published As

Publication number Publication date
JPS5969936A (ja) 1984-04-20

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