JPH0440869B2 - - Google Patents

Info

Publication number
JPH0440869B2
JPH0440869B2 JP61095430A JP9543086A JPH0440869B2 JP H0440869 B2 JPH0440869 B2 JP H0440869B2 JP 61095430 A JP61095430 A JP 61095430A JP 9543086 A JP9543086 A JP 9543086A JP H0440869 B2 JPH0440869 B2 JP H0440869B2
Authority
JP
Japan
Prior art keywords
synthetic resin
optical semiconductor
mold
diffusing agent
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61095430A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62252181A (ja
Inventor
Hiromoto Tamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP61095430A priority Critical patent/JPS62252181A/ja
Publication of JPS62252181A publication Critical patent/JPS62252181A/ja
Publication of JPH0440869B2 publication Critical patent/JPH0440869B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP61095430A 1986-04-24 1986-04-24 光半導体素子の製造方法 Granted JPS62252181A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61095430A JPS62252181A (ja) 1986-04-24 1986-04-24 光半導体素子の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61095430A JPS62252181A (ja) 1986-04-24 1986-04-24 光半導体素子の製造方法

Publications (2)

Publication Number Publication Date
JPS62252181A JPS62252181A (ja) 1987-11-02
JPH0440869B2 true JPH0440869B2 (enrdf_load_stackoverflow) 1992-07-06

Family

ID=14137476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61095430A Granted JPS62252181A (ja) 1986-04-24 1986-04-24 光半導体素子の製造方法

Country Status (1)

Country Link
JP (1) JPS62252181A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10190066A (ja) * 1996-12-27 1998-07-21 Nichia Chem Ind Ltd 発光ダイオード及びそれを用いたｌｅｄ表示装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5221641A (en) * 1991-06-21 1993-06-22 Rohm Co., Ltd. Process for making light emitting diodes
DE19526389A1 (de) * 1995-07-19 1997-01-23 Siemens Ag Halbleiterlaserchip und Infrarot-Emitter-Bauelement

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4899063U (enrdf_load_stackoverflow) * 1972-02-28 1973-11-22
JPS5344591Y2 (enrdf_load_stackoverflow) * 1974-09-09 1978-10-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10190066A (ja) * 1996-12-27 1998-07-21 Nichia Chem Ind Ltd 発光ダイオード及びそれを用いたｌｅｄ表示装置

Also Published As

Publication number Publication date
JPS62252181A (ja) 1987-11-02

Similar Documents

Publication Publication Date Title
US4654290A (en) Laser markable molding compound, method of use and device therefrom
ATE21788T1 (de) Formmasse, verfahren zu deren herstellung und anwendung fuer halbleitereinbettung.
JPH0440869B2 (enrdf_load_stackoverflow)
KR20090115535A (ko) 칩 엘이디 패키지 제조방법
JP2001060724A (ja) 拡散発光素子およびその製造方法
JPS6457769A (en) Magnetic force detecting semiconductor element and manufacture thereof
JPS6138878B2 (enrdf_load_stackoverflow)
JPH07237229A (ja) 複合型成形品およびその製造方法
JPH0361195B2 (enrdf_load_stackoverflow)
JPH05206524A (ja) 光半導体用モールド樹脂
JPH0311895Y2 (enrdf_load_stackoverflow)
EP0319175A3 (en) Method of forming a solid article
DE69032571D1 (de) Verfahren zur Herstellung von Halbleiteranordnungen mit durch Graben isolierten Komponenten
JPS6092678A (ja) 表示用発光ダイオ−ドの製造方法
JPS6251493B2 (enrdf_load_stackoverflow)
CN209045604U (zh) 一种新型指示类led光源封装结构
JPS6222557B2 (enrdf_load_stackoverflow)
JPS5556676A (en) Manufacture of semiconductor light-emitting device
JPS6263985A (ja) 発光装置の製造方法
JPS56103482A (en) Manufacture of semiconductor device for photoelectric conversion
JPH06161375A (ja) ディスプレイ装置
JPS5614452A (en) Stained glass and its manufacture
JPS63293889A (ja) 光半導体装置とその製造方法
JPH02312249A (ja) 半導体装置の製造方法
JPH07101263B2 (ja) 導光板装置