JPH0311895Y2 - - Google Patents

Info

Publication number
JPH0311895Y2
JPH0311895Y2 JP1983137735U JP13773583U JPH0311895Y2 JP H0311895 Y2 JPH0311895 Y2 JP H0311895Y2 JP 1983137735 U JP1983137735 U JP 1983137735U JP 13773583 U JP13773583 U JP 13773583U JP H0311895 Y2 JPH0311895 Y2 JP H0311895Y2
Authority
JP
Japan
Prior art keywords
light
light emitting
emitting diode
display surface
display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983137735U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6045453U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983137735U priority Critical patent/JPS6045453U/ja
Publication of JPS6045453U publication Critical patent/JPS6045453U/ja
Application granted granted Critical
Publication of JPH0311895Y2 publication Critical patent/JPH0311895Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1983137735U 1983-09-05 1983-09-05 表示用発光ダイオ−ド Granted JPS6045453U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983137735U JPS6045453U (ja) 1983-09-05 1983-09-05 表示用発光ダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983137735U JPS6045453U (ja) 1983-09-05 1983-09-05 表示用発光ダイオ−ド

Publications (2)

Publication Number Publication Date
JPS6045453U JPS6045453U (ja) 1985-03-30
JPH0311895Y2 true JPH0311895Y2 (enrdf_load_stackoverflow) 1991-03-20

Family

ID=30309271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983137735U Granted JPS6045453U (ja) 1983-09-05 1983-09-05 表示用発光ダイオ−ド

Country Status (1)

Country Link
JP (1) JPS6045453U (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4322987B2 (ja) * 1999-01-27 2009-09-02 スタンレー電気株式会社 Ｌｅｄランプおよびその製造方法
JP2010021497A (ja) * 2008-07-14 2010-01-28 Sanyo Electric Co Ltd 半導体発光装置
JP5660766B2 (ja) * 2009-06-26 2015-01-28 日亜化学工業株式会社 発光装置
JP5284432B2 (ja) * 2011-09-02 2013-09-11 三菱レイヨン株式会社 光源装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5785273A (en) * 1980-11-17 1982-05-27 Toshiba Corp Photo-semiconductor device

Also Published As

Publication number Publication date
JPS6045453U (ja) 1985-03-30

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