ATE21788T1 - Formmasse, verfahren zu deren herstellung und anwendung fuer halbleitereinbettung. - Google Patents

Formmasse, verfahren zu deren herstellung und anwendung fuer halbleitereinbettung.

Info

Publication number
ATE21788T1
ATE21788T1 AT82102522T AT82102522T ATE21788T1 AT E21788 T1 ATE21788 T1 AT E21788T1 AT 82102522 T AT82102522 T AT 82102522T AT 82102522 T AT82102522 T AT 82102522T AT E21788 T1 ATE21788 T1 AT E21788T1
Authority
AT
Austria
Prior art keywords
weight percent
composition
poly
masterbatch
fused silica
Prior art date
Application number
AT82102522T
Other languages
English (en)
Inventor
Donald Gene Needham
Original Assignee
Phillips Petroleum Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phillips Petroleum Co filed Critical Phillips Petroleum Co
Application granted granted Critical
Publication of ATE21788T1 publication Critical patent/ATE21788T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/301—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen or carbon in the main chain of the macromolecule, not provided for in group H01B3/302
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C08K7/20—Glass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
AT82102522T 1981-03-26 1982-03-25 Formmasse, verfahren zu deren herstellung und anwendung fuer halbleitereinbettung. ATE21788T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/247,687 US4337182A (en) 1981-03-26 1981-03-26 Poly (arylene sulfide) composition suitable for use in semi-conductor encapsulation
EP82102522A EP0062806B1 (de) 1981-03-26 1982-03-25 Formmasse, Verfahren zu deren Herstellung und Anwendung für Halbleitereinbettung

Publications (1)

Publication Number Publication Date
ATE21788T1 true ATE21788T1 (de) 1986-09-15

Family

ID=22935924

Family Applications (1)

Application Number Title Priority Date Filing Date
AT82102522T ATE21788T1 (de) 1981-03-26 1982-03-25 Formmasse, verfahren zu deren herstellung und anwendung fuer halbleitereinbettung.

Country Status (7)

Country Link
US (1) US4337182A (de)
EP (1) EP0062806B1 (de)
JP (1) JPS57158256A (de)
AT (1) ATE21788T1 (de)
CA (1) CA1200946A (de)
DE (1) DE3272822D1 (de)
PT (1) PT74662B (de)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56114335A (en) 1980-02-13 1981-09-08 Fujitsu Ltd Semiconductor device and its manufacture
US4528310A (en) * 1981-09-10 1985-07-09 Phillips Petroleum Company Glass-filled poly(arylene sulfide) compositions containing organosilanes
US4994514A (en) * 1982-07-16 1991-02-19 Phillips Petroleum Company Encapsulation of electronic components with poly(arylene sulfide) containing mercaptosilane
US4782195A (en) * 1982-07-16 1988-11-01 Phillips Petroleum Company Encapsulation of electronic components with poly(arylene sulfide) containing mercaptosilane
US4434263A (en) 1982-07-20 1984-02-28 Phillips Petroleum Company Hydrolytic stability improving additive
US4482665A (en) * 1982-09-14 1984-11-13 Phillips Petroleum Company Encapsulation of electronic components with calcium silicate-containing poly(arylene sulfide) compositions
US4560580A (en) * 1982-09-30 1985-12-24 Phillips Petroleum Company Process for encapsulating articles with optional laser printing
US4443571A (en) * 1982-09-30 1984-04-17 Phillips Petroleum Company Laser printable polyarylene sulfide compositions
US4654225A (en) * 1982-09-30 1987-03-31 Phillips Petroleum Company Laser printable polyarylene sulfide compositions process for encapsulating articles with optional laser printing
JPS6011062B2 (ja) * 1982-10-13 1985-03-22 東レ株式会社 ガラス繊維強化ポリフエニレンスルフイド樹脂組成物
US4436865A (en) 1982-11-29 1984-03-13 Phillips Petroleum Company Poly(arylene sulfide) composition suitable for molding
US4514588A (en) * 1982-12-28 1985-04-30 Phillips Petroleum Company Encapsulated electronic components and encapsulation compositions
US4659761A (en) * 1983-03-18 1987-04-21 Phillips Petroleum Company Zinc oxide in poly(arylene sulfide) compositions
US4504551A (en) * 1983-04-28 1985-03-12 Phillips Petroleum Company Poly(arylene sulfide) compositions
US4527219A (en) * 1983-10-19 1985-07-02 Phillips Petroleum Company Poly(arylene sulfide) electrical component
CA1241482A (en) * 1985-04-16 1988-08-30 John E. Leland Poly(arylene sulfide) compositions with improved insulation resistance and cracking resistance
US4680326A (en) * 1985-04-16 1987-07-14 Phillips Petroleum Company Poly(arylene sulfide) composition with improved insulation resistance and cracking resistance
GB2174063B (en) * 1985-04-22 1988-08-17 Philips Electronic Associated Semiconductor device having a laser printable envelope
JPH07742B2 (ja) * 1986-04-03 1995-01-11 大日本インキ化学工業株式会社 ポリフエニレンサルフアイド樹脂組成物
US4708983A (en) * 1986-06-18 1987-11-24 Phillips Petroleum Company Arylene sulfide polymers of improved impact strength
US4810590A (en) * 1987-02-19 1989-03-07 Phillips Petroleum Company Poly(arylene sulfide) encapsulation process and article
US4749598A (en) * 1987-02-19 1988-06-07 Phillips Petroleum Company Poly(arylene sulfide) composition and process
US4767841A (en) * 1987-02-24 1988-08-30 Phillips Petroleum Company Arylene sulfide polymer preparation from dehydrated admixture comprising sulfur source, cyclic amide solvent and water
JPH0621169B2 (ja) * 1987-04-06 1994-03-23 ポリプラスチックス株式会社 改良されたポリフエニレンサルフアイド樹脂の製造方法
US4877565A (en) * 1987-06-19 1989-10-31 Murata Manufacturing Co., Ltd. Method of manufacturing circuit component such as stator for variable resistor
JPH0639113B2 (ja) * 1987-09-02 1994-05-25 ポリプラスチックス株式会社 ウエルド部を有するポリアリーレンサルファイド樹脂成形品
EP0302648A3 (de) * 1987-08-03 1989-08-09 Polyplastics Co. Ltd. Schweissnaht enthaltender Formkörper aus Polyarylensulfidharz
US4992497A (en) * 1989-04-10 1991-02-12 Phillips Petroleum Company Glass filled poly(arylene sulfide) compositions and methods
CA2014561A1 (en) * 1989-06-05 1990-12-05 Roy F. Wright Glass-filled poly(arylene sulfide) compositions and methods
DE3937333A1 (de) * 1989-11-09 1991-05-16 Bayer Ag Mischungen aus polyarylensulfiden, glasfasern und nitrogruppenhaltigen silanen
CA2019514A1 (en) * 1989-11-13 1991-05-13 Mark W. Woods Poly(arylene sulfide) compositions with strengthened weldline
US5079290A (en) * 1989-12-26 1992-01-07 Phillips Petroleum Company Poly(arylene sulfide) composition
US5064936A (en) * 1990-02-20 1991-11-12 Phillips Petroleum Company Process for preparing high extrusion rate arylene sulfide polymers
CA2032090A1 (en) * 1990-03-19 1991-09-20 David A. Soules Poly(arylene sulfide) resins reinforced with glass fibers
US5298318A (en) * 1990-03-21 1994-03-29 Phillips Petroleum Company Poly(arylene sulfide) resins reinforced with glass fibers
US5183844A (en) * 1990-07-02 1993-02-02 Phillips Petroleum Company Poly(arylene sulfide) composition and method using silica to reduce drool
US5175243A (en) * 1990-11-14 1992-12-29 Phillips Petroleum Company Process for preparing arylene sulfide polymers with halo benzene containing deactivating group
US5115093A (en) * 1990-11-23 1992-05-19 Phillips Petroleum Company Process for preparing arylene sulfide polymers in the presence of functionalized olefin
JP2918328B2 (ja) * 1990-11-26 1999-07-12 株式会社デンソー 樹脂の選定方法及びこの選定方法により選定された樹脂を有する樹脂封止型半導体装置
CA2074235C (en) * 1991-07-18 2000-02-08 Hiroshi Itoh Hardenable composition, aqueous gel and applications thereof
JP2927081B2 (ja) * 1991-10-30 1999-07-28 株式会社デンソー 樹脂封止型半導体装置
US5958100A (en) * 1993-06-03 1999-09-28 Micron Technology, Inc. Process of making a glass semiconductor package
JPH0722722A (ja) * 1993-07-05 1995-01-24 Mitsubishi Electric Corp 樹脂成形タイプの電子回路装置
US5610219A (en) * 1994-03-18 1997-03-11 Mitsubishi Denki Kabushiki Kaisha Resin compound for molding precision parts, and sleeve and ferrule produced therefrom
US5835679A (en) 1994-12-29 1998-11-10 Energy Converters, Inc. Polymeric immersion heating element with skeletal support and optional heat transfer fins
JP2625654B2 (ja) * 1995-04-28 1997-07-02 日本電気株式会社 半導体装置およびその製造方法
CN1189769C (zh) * 1998-04-13 2005-02-16 住友电气工业株式会社 光纤定位部件
JP4295848B2 (ja) * 1998-12-24 2009-07-15 出光興産株式会社 電子部品封止用ポリアリーレンスルフィド樹脂組成物
US6263158B1 (en) 1999-05-11 2001-07-17 Watlow Polymer Technologies Fibrous supported polymer encapsulated electrical component
US6188051B1 (en) 1999-06-01 2001-02-13 Watlow Polymer Technologies Method of manufacturing a sheathed electrical heater assembly
US6392208B1 (en) 1999-08-06 2002-05-21 Watlow Polymer Technologies Electrofusing of thermoplastic heating elements and elements made thereby
US6392206B1 (en) 2000-04-07 2002-05-21 Waltow Polymer Technologies Modular heat exchanger
US6433317B1 (en) 2000-04-07 2002-08-13 Watlow Polymer Technologies Molded assembly with heating element captured therein
US6519835B1 (en) 2000-08-18 2003-02-18 Watlow Polymer Technologies Method of formable thermoplastic laminate heated element assembly
US6539171B2 (en) 2001-01-08 2003-03-25 Watlow Polymer Technologies Flexible spirally shaped heating element
JP6027935B2 (ja) * 2013-03-29 2016-11-16 出光ライオンコンポジット株式会社 ポリアリーレンスルフィド樹脂組成物及びその用途

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3496427A (en) * 1966-01-13 1970-02-17 Gen Electric Semiconductor device with composite encapsulation
US3626051A (en) * 1969-09-19 1971-12-07 James P Liautaud Injection molding encapsulation of paper-wound flyback transformers and the like
US3679941A (en) * 1969-09-22 1972-07-25 Gen Electric Composite integrated circuits including semiconductor chips mounted on a common substrate with connections made through a dielectric encapsulator
JPS5077462A (de) * 1973-11-13 1975-06-24
JPS5112861A (ja) * 1974-07-24 1976-01-31 Mitsui Petrochemical Ind Horiariirensurufuidojushisoseibutsu
US3988286A (en) * 1974-08-23 1976-10-26 Phillips Petroleum Company Heat curable poly(arylene sulfide) compositions
US4034466A (en) * 1974-09-03 1977-07-12 Motorola, Inc. Package and method for a semiconductor radiant energy emitting device
JPS5171792A (de) * 1974-12-19 1976-06-21 Minolta Camera Kk
JPS5252958A (en) * 1975-10-23 1977-04-28 Mitsubishi Rayon Co Ltd Glass-fiber reinforced polyphenylene sulfide resin compositions
CA1102107A (en) * 1976-07-01 1981-06-02 Donald G. Needham Arc resistant composition
US4134874A (en) * 1977-09-19 1979-01-16 Phillips Petroleum Company Processing aid for poly(arylene sulfide) resins
FR2410661A1 (fr) * 1977-12-02 1979-06-29 Phillips Petroleum Co Compositions resistant aux effets d'arc, renfermant du poly(sulfure d'arylene) et des produits de charge
SU977080A1 (ru) * 1979-03-07 1982-11-30 Предприятие П/Я А-7697 Стан мокрого волочени проволоки без скольжени

Also Published As

Publication number Publication date
EP0062806A1 (de) 1982-10-20
CA1200946A (en) 1986-02-18
JPS57158256A (en) 1982-09-30
DE3272822D1 (en) 1986-10-02
US4337182A (en) 1982-06-29
PT74662B (en) 1983-11-08
PT74662A (en) 1982-04-01
EP0062806B1 (de) 1986-08-27

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