JPS62502673A - 熱可塑性半田付け材料、方法及び装置 - Google Patents

熱可塑性半田付け材料、方法及び装置

Info

Publication number
JPS62502673A
JPS62502673A JP61502001A JP50200186A JPS62502673A JP S62502673 A JPS62502673 A JP S62502673A JP 61502001 A JP61502001 A JP 61502001A JP 50200186 A JP50200186 A JP 50200186A JP S62502673 A JPS62502673 A JP S62502673A
Authority
JP
Japan
Prior art keywords
soldering
soldered
temperature
contacts
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61502001A
Other languages
English (en)
Japanese (ja)
Inventor
ヴエンデイツシユ，カール　ハインツ
Original Assignee
カ−　ヴエ−　エレクトロニツク　ゲ−エムベ−ハ−　ウント　コンパニ−　カ−ゲ−
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by カ−　ヴエ−　エレクトロニツク　ゲ−エムベ−ハ−　ウント　コンパニ−　カ−ゲ− filed Critical カ−　ヴエ−　エレクトロニツク　ゲ−エムベ−ハ−　ウント　コンパニ−　カ−ゲ−
Publication of JPS62502673A publication Critical patent/JPS62502673A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
JP61502001A 1985-03-20 1986-03-14 熱可塑性半田付け材料、方法及び装置 Pending JPS62502673A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19853510000 DE3510000A1 (de) 1985-03-20 1985-03-20 Thermoplastisches loetmittel und verfahren und vorrichtung zu dessen verwendung
DE3510000.1 1985-03-20

Publications (1)

Publication Number Publication Date
JPS62502673A true JPS62502673A (ja) 1987-10-15

Family

ID=6265760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61502001A Pending JPS62502673A (ja) 1985-03-20 1986-03-14 熱可塑性半田付け材料、方法及び装置

Country Status (8)

Country Link
EP (1) EP0219517B1 (enExample)
JP (1) JPS62502673A (enExample)
AT (1) ATE45692T1 (enExample)
AU (1) AU5664686A (enExample)
BR (1) BR8606737A (enExample)
DE (2) DE3510000A1 (enExample)
DK (1) DK552386D0 (enExample)
WO (1) WO1986005428A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02259721A (ja) * 1989-03-31 1990-10-22 Tokyo Electron Ltd 液晶基板の製造装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4831724A (en) * 1987-08-04 1989-05-23 Western Digital Corporation Apparatus and method for aligning surface mountable electronic components on printed circuit board pads
JPH0747233B2 (ja) * 1987-09-14 1995-05-24 古河電気工業株式会社 半田析出用組成物および半田析出方法
DE3908097A1 (de) * 1989-03-13 1990-09-20 Irion & Vosseler Praegefolie zum aufbringen von leiterbahnen auf feste oder plastische unterlagen
DE4033430A1 (de) * 1990-10-20 1992-04-23 Licentia Gmbh Verfahren zum herstellen eines lotmittelauftrags
US5346558A (en) * 1993-06-28 1994-09-13 W. R. Grace & Co.-Conn. Solderable anisotropically conductive composition and method of using same
JP3498427B2 (ja) * 1995-06-19 2004-02-16 ソニー株式会社 成形はんだ用フラックス

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2833030A (en) * 1952-09-19 1958-05-06 Wall Colmonoy Corp Method of joining metal parts with flexible composite joining material
GB1131375A (en) * 1967-05-12 1968-10-23 Standard Telephones Cables Ltd Copper brazing paste
GB1375997A (enExample) * 1970-12-31 1974-12-04
CH569543A5 (enExample) * 1972-07-26 1975-11-28 Castolin Sa
US3915729A (en) * 1974-04-09 1975-10-28 Du Pont High temperature solder pastes
ES490073A0 (es) * 1979-04-06 1981-05-16 Johnson Matthey Co Ltd Procedimiento para la obtencion de una composicion para sol-dar.
DE2914621A1 (de) * 1979-04-11 1980-10-23 Standard Elektrik Lorenz Ag Verfahren zum loeten von bauelementen in hybridschaltkreise und einrichtung zur durchfuehrung des verfahrens
FR2476428A1 (fr) * 1980-02-15 1981-08-21 Tech Electro Cie Indle Procede de fixation de composants electroniques sur un circuit imprime et produit obtenu par ce procede
DE3010610A1 (de) * 1980-03-20 1981-10-01 Schoeller & Co Elektronik Gmbh, 3552 Wetter Verfahren zur selektiven verzinnung der loetaugen von gedruckten schaltungen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02259721A (ja) * 1989-03-31 1990-10-22 Tokyo Electron Ltd 液晶基板の製造装置

Also Published As

Publication number Publication date
BR8606737A (pt) 1987-08-11
EP0219517B1 (de) 1989-08-23
DE3510000C2 (enExample) 1990-02-15
DK552386A (da) 1986-11-19
EP0219517A1 (de) 1987-04-29
DK552386D0 (da) 1986-11-19
DE3510000A1 (de) 1986-10-02
DE3665141D1 (en) 1989-09-28
AU5664686A (en) 1986-10-13
ATE45692T1 (de) 1989-09-15
WO1986005428A1 (fr) 1986-09-25

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