JPS6244531Y2 - - Google Patents

Info

Publication number
JPS6244531Y2
JPS6244531Y2 JP1981123497U JP12349781U JPS6244531Y2 JP S6244531 Y2 JPS6244531 Y2 JP S6244531Y2 JP 1981123497 U JP1981123497 U JP 1981123497U JP 12349781 U JP12349781 U JP 12349781U JP S6244531 Y2 JPS6244531 Y2 JP S6244531Y2
Authority
JP
Japan
Prior art keywords
metal wire
thin metal
semiconductor element
lead
bonding pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981123497U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5829836U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981123497U priority Critical patent/JPS5829836U/ja
Publication of JPS5829836U publication Critical patent/JPS5829836U/ja
Application granted granted Critical
Publication of JPS6244531Y2 publication Critical patent/JPS6244531Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/07551—
    • H10W72/5449—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP1981123497U 1981-08-19 1981-08-19 半導体装置 Granted JPS5829836U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981123497U JPS5829836U (ja) 1981-08-19 1981-08-19 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981123497U JPS5829836U (ja) 1981-08-19 1981-08-19 半導体装置

Publications (2)

Publication Number Publication Date
JPS5829836U JPS5829836U (ja) 1983-02-26
JPS6244531Y2 true JPS6244531Y2 (cg-RX-API-DMAC10.html) 1987-11-25

Family

ID=29917398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981123497U Granted JPS5829836U (ja) 1981-08-19 1981-08-19 半導体装置

Country Status (1)

Country Link
JP (1) JPS5829836U (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JPS5829836U (ja) 1983-02-26

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