JPS6243542B2 - - Google Patents

Info

Publication number
JPS6243542B2
JPS6243542B2 JP56148701A JP14870181A JPS6243542B2 JP S6243542 B2 JPS6243542 B2 JP S6243542B2 JP 56148701 A JP56148701 A JP 56148701A JP 14870181 A JP14870181 A JP 14870181A JP S6243542 B2 JPS6243542 B2 JP S6243542B2
Authority
JP
Japan
Prior art keywords
tray
die
drive motor
direction drive
dies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56148701A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5850751A (ja
Inventor
Noboru Fujino
Masayuki Shimura
Kazuhiro Hayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP14870181A priority Critical patent/JPS5850751A/ja
Publication of JPS5850751A publication Critical patent/JPS5850751A/ja
Publication of JPS6243542B2 publication Critical patent/JPS6243542B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP14870181A 1981-09-22 1981-09-22 ダイ詰め換え方法 Granted JPS5850751A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14870181A JPS5850751A (ja) 1981-09-22 1981-09-22 ダイ詰め換え方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14870181A JPS5850751A (ja) 1981-09-22 1981-09-22 ダイ詰め換え方法

Publications (2)

Publication Number Publication Date
JPS5850751A JPS5850751A (ja) 1983-03-25
JPS6243542B2 true JPS6243542B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-09-14

Family

ID=15458659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14870181A Granted JPS5850751A (ja) 1981-09-22 1981-09-22 ダイ詰め換え方法

Country Status (1)

Country Link
JP (1) JPS5850751A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6123333A (ja) * 1984-07-11 1986-01-31 Hitachi Yonezawa Denshi Kk 電子部品の測定方法
JPH0392034U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1989-12-29 1991-09-19
KR20010055252A (ko) * 1999-12-10 2001-07-04 마이클 디. 오브라이언 반도체패키지 제조용 싱귤레이션 장비의 오프 로더
KR20130054787A (ko) * 2011-11-17 2013-05-27 삼성전자주식회사 반도체 테스트 장비

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553608A (en) * 1978-06-21 1980-01-11 Hitachi Ltd Supplying method for plurality of article
JPS596058B2 (ja) * 1978-11-21 1984-02-08 株式会社東芝 半導体装置の製造装置
JPS55165641A (en) * 1979-06-11 1980-12-24 Hitachi Ltd Device for bonding pellet

Also Published As

Publication number Publication date
JPS5850751A (ja) 1983-03-25

Similar Documents

Publication Publication Date Title
JPS60171799A (ja) 電子部品自動装着装置
JPS63211645A (ja) ウエハーを装着及び離脱する方法及び装置
US6065201A (en) Method of transferring conductive balls onto work piece
CN109531616B (zh) 装配机构及具有其的液晶屏装配装置
JPH01295500A (ja) チップ状電子部品マウント方法及びその装置
JP2001185565A (ja) マルチチップボンディング方法及び装置
JPH09186180A (ja) ダイボンディング装置
JPS6243542B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN101379896A (zh) 确定元件拾取次序的方法
CN205820360U (zh) 一种抓取放置玻璃的装置
JP3376875B2 (ja) 導電性ボールの移載装置および移載方法
JP2946845B2 (ja) 電子部品実装装置のノズル交換装置
JPH088293B2 (ja) チップ実装装置
JP2736637B2 (ja) チップボンディング方法
JPH0344434B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0247118B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2746989B2 (ja) チップの位置決め方法およびその装置、インナリードボンディング装置およびインナリードボンディング方法
CN220406390U (zh) 上料筛选机构及传送装置
KR0154432B1 (ko) 부품의 2단위치결정 센터링부가 설치된 전자부품 조립장치
JPH0897595A (ja) 電子部品実装装置
JP2000252305A (ja) チップマウント装置
JPH08162494A (ja) 半田ボールの搭載装置
JPH11163191A (ja) 半導体装置切断収納装置
JP2978980B2 (ja) 自動組立装置およびそのための部品供給方法
JP3203702B2 (ja) フィルムキャリアの打抜装置のクリーニングユニット