JPS6242388B2 - - Google Patents

Info

Publication number
JPS6242388B2
JPS6242388B2 JP59152897A JP15289784A JPS6242388B2 JP S6242388 B2 JPS6242388 B2 JP S6242388B2 JP 59152897 A JP59152897 A JP 59152897A JP 15289784 A JP15289784 A JP 15289784A JP S6242388 B2 JPS6242388 B2 JP S6242388B2
Authority
JP
Japan
Prior art keywords
lead
frame
resin
tab
piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59152897A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60121751A (ja
Inventor
Hidetoshi Mochizuki
Keizo Ootsuki
Akira Suzuki
Yoshio Adachi
Hideki Kosaka
Hajime Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15289784A priority Critical patent/JPS60121751A/ja
Publication of JPS60121751A publication Critical patent/JPS60121751A/ja
Publication of JPS6242388B2 publication Critical patent/JPS6242388B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP15289784A 1984-07-25 1984-07-25 半導体装置の製法 Granted JPS60121751A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15289784A JPS60121751A (ja) 1984-07-25 1984-07-25 半導体装置の製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15289784A JPS60121751A (ja) 1984-07-25 1984-07-25 半導体装置の製法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP9360378A Division JPS5521124A (en) 1978-08-02 1978-08-02 Lead frame

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP8091387A Division JPS62282455A (ja) 1987-04-03 1987-04-03 半導体装置の製法

Publications (2)

Publication Number Publication Date
JPS60121751A JPS60121751A (ja) 1985-06-29
JPS6242388B2 true JPS6242388B2 (enrdf_load_stackoverflow) 1987-09-08

Family

ID=15550519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15289784A Granted JPS60121751A (ja) 1984-07-25 1984-07-25 半導体装置の製法

Country Status (1)

Country Link
JP (1) JPS60121751A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62282455A (ja) * 1987-04-03 1987-12-08 Hitachi Ltd 半導体装置の製法
JPH05136327A (ja) * 1991-11-12 1993-06-01 Toshiba Corp 半導体パツケージ
JP3384901B2 (ja) * 1995-02-02 2003-03-10 三菱電機株式会社 リードフレーム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5294074A (en) * 1976-02-04 1977-08-08 Hitachi Ltd Leading-in frame
JPS5363979A (en) * 1976-11-19 1978-06-07 Hitachi Ltd Sealing method of semiconductor element and lead frame used for the same
JPS5381073A (en) * 1976-12-27 1978-07-18 Hitachi Ltd Oroduction of resin seal type semiconductor device and lead frame used the same
JPS6217381A (ja) * 1985-07-12 1987-01-26 Sanyo Electric Co Ltd 高圧用圧縮機

Also Published As

Publication number Publication date
JPS60121751A (ja) 1985-06-29

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