JPS6240857B2 - - Google Patents
Info
- Publication number
- JPS6240857B2 JPS6240857B2 JP12090582A JP12090582A JPS6240857B2 JP S6240857 B2 JPS6240857 B2 JP S6240857B2 JP 12090582 A JP12090582 A JP 12090582A JP 12090582 A JP12090582 A JP 12090582A JP S6240857 B2 JPS6240857 B2 JP S6240857B2
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- substrate
- trench
- semiconductor
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 21
- 239000004065 semiconductor Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000012535 impurity Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 230000001590 oxidative effect Effects 0.000 claims description 4
- 238000000206 photolithography Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 description 11
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
- H01L21/76205—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO in a region being recessed from the surface, e.g. in a recess, groove, tub or trench region
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Local Oxidation Of Silicon (AREA)
- Element Separation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12090582A JPS5911645A (ja) | 1982-07-12 | 1982-07-12 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12090582A JPS5911645A (ja) | 1982-07-12 | 1982-07-12 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5911645A JPS5911645A (ja) | 1984-01-21 |
JPS6240857B2 true JPS6240857B2 (enrdf_load_stackoverflow) | 1987-08-31 |
Family
ID=14797895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12090582A Granted JPS5911645A (ja) | 1982-07-12 | 1982-07-12 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5911645A (enrdf_load_stackoverflow) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5008180A (en) * | 1989-04-07 | 1991-04-16 | Eastman Kodak Company | Photographic recording material containing a cyan dye-forming coupler |
KR960014452B1 (ko) * | 1993-12-22 | 1996-10-15 | 금성일렉트론 주식회사 | 반도체 소자분리 방법 |
US5472904A (en) * | 1994-03-02 | 1995-12-05 | Micron Technology, Inc. | Thermal trench isolation |
US5438016A (en) * | 1994-03-02 | 1995-08-01 | Micron Semiconductor, Inc. | Method of semiconductor device isolation employing polysilicon layer for field oxide formation |
US5753962A (en) * | 1996-09-16 | 1998-05-19 | Micron Technology, Inc. | Texturized polycrystalline silicon to aid field oxide formation |
KR100444607B1 (ko) * | 2002-10-24 | 2004-08-16 | 주식회사 하이닉스반도체 | 반도체 소자의 소자분리막 형성방법 |
-
1982
- 1982-07-12 JP JP12090582A patent/JPS5911645A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5911645A (ja) | 1984-01-21 |